Method of fabrication and reinforcing high solids-containing materials

Abstract

Abstract THIS DISCLOSURE IS DIRECTED TO AN IMPROVED METHOD FOR PREPARING FABRIC-REINFORCED MOLDED PLASTIC ARTICLES AND INVOLVES THE UTILIZATION OF AT LEAST ONE PREBONDED COMPOSITE OF A FABRIC REINFORCING MATERIAL AND A COHERENT LAYER OF MOLD RELEASE MATERIAL WHICH IS SUBSTANTIALLY IMPERVIOUS TO NON-SOLVENT LIQUIDS, THE TWO BEING ADHERED BY AN ADHESIVE WHOSE BOND STRENGTH IS DIMINISHED SIGNIFICANTLY SUBSEQUENT TO MOLDING. THE DIMINUTION IN THE ADHESIVE BOND WHICH OCCURS DURING THE MOLDING AND/OR CURING ALLOWS THE MOLD RELEASE SHEET TO BE REMOVED READILY FROM THE FABRIC (SUFACE) REINFORCED MOLDED ARTICLE WITHOUT ANY SIGNIFICANT SURFACE DEFORMATION THERETO. BOTH WOVEN AND NON-WOVEN FABRICS CAN BE EMPLOYED: BY FOR MOST MOLDED ARTICLES, THE USE OF WOVEN CLOTH OR WOVEN FABRIC IS PREFERRED. IN THE CASE OF MOLED CIRCUIT BOARDS, A PREFERRED FABRIC REINFORCEMENT IS "DACRON" CLOTH; A PREFERRED SOLID MOLD RELEASE SHEET MATERIAL IS "MYLAR" (POLYETHYLENE GLYCOL TEREPHTHALATE) A PREFERRED ADHESIVE TO PREBOND THE REINFORCING CLOTH TO THE MOLD RELEASE SHEET IS A COMPATIBLE POLYESTER ADHESIVE AND A PREFERRED CLASS OF MOLDING PLASTICS IS EPOXY RESINS.

Inventors

• 👤 Carl K Schaab
• 👤 George T Weyrauch
• 👤 Terry R Davis

Bibliographic Details