Abstract A process is disclosed for bonding magnetic heads by forming a low magnetic permeability spacer between pole pieces of a magnetic head. A primary gap material is deposited, preferably by R.F. sputtering, on the pole pieces. A bonding layer is deposited over the primary gap material, also preferably by R.F. sputtering. The thus coated pole pieces are vacuum degassed and heated to a temperature in the range of 150* to 450* C. The bonding layers are then mated and a pressure of from 50 to 100 psi is applied and held between 1/2 and 4 hours. Any material which has a relatively low magnetic permeability and can be applied by R.F. sputtering or thermal evaporation is suitable for the primary gap material. The bonding layer is formed of either copper, silver, gold or titanium, or any material which produces a good diffusion bond under the above conditions.
The method of claim 1 including a step of holding the first and second pole faces with the primary gap material and bonding layers thereon at a temperature within the range 150* to 250* C and a vacuum within the range 10-7 Torr to 10-11 Torr to permit vacuum degassing of the first and second pole faces and the primary gap material and bonding layers.
Claim 2
Dependent Claim
19 words
The method of claim 1 wherein the primary gap material and the bonding layers are deposited by R.F. sputtering.
Claim 3
Dependent Claim
22 words
The method of claim 1 wherein in said joining step the pressure is applied for a period between 1/2 and 4 hours.
Claim 4
Dependent Claim
34 words
The method of claim 1 wherein the primary gap material is selected from the group consisting of molybdenum, tungsten, silicon nitride, alumina, tantalum, copper, gold, tantalum nitride, silicon monoxide, silver, glasses and metal-ceramic combinations.
Claim 5
Dependent Claim
21 words
The method of claim 5 wherein the bonding layers are selected from the group consisting of copper, silver, gold and titanium.
Claim 6
Dependent Claim
19 words
The method of claim 6 wherein the primary gap material and the bonding layers are deposited by R.F. sputtering.
Claim 7
Dependent Claim
22 words
The method of claim 7 wherein the primary gap material is deposited to a thickness within the range 5 to 150 micro-inches.
Claim 8
Dependent Claim
22 words
The method of claim 8 wherein the bonding layer is deposited to a thickness within the range 500 to 1,000 A. units.
Claim 9
Dependent Claim
19 words
The method of claim 9 wherein said joining step takes place in a vacuum of at least 10-8 Torr.