Diode matrix card

Claim 2

In the memory stack comprising the memory assembly plane and the diode matrix card, a coupling system comprising a combination of a pair of grounding means respectively arranged onto the uppermost and lowermost position of said memory assembly plane, a pair of connector means respectively provided to oppose to each of said grounding means and connected to driving lines of the matrix, a diode matrix card having on a surface of an insulative base plate a group of diodes arranged in a plurality of rows as vertically mounted, a ground pattern insulated from said group of diodes, and a pair of connectors respectively opposing to each of said pair of gounding means, and on the other surface a printed circuit to electrically connect a predetermined group of said diodes to one of said pair of connectors, a plurality of conductive bars to electrically connect the other predetermined group of said diodes to the other one of the connectors, and a ground pattern separated from said printed circuit, said diode matrix card further having at least a pair of mounting holes at positions to penetrate through said ground patterns on both surfaces of the card and to oppose to each of said pair of grounding means, and at least a pair of fixing screws to be inserted through said mounting holes for fixing the card to said grounding means, so that when the diode matrix card is fixed to the grounding Means by said fixing screws desired electric circuit and grounding circuit between the memory assembly plane and the diode matrix card are simultaneously established through said opposing connector means and connectors and said fixing screws.

Claim 3

In the memory stack comprising the memory assembly plane and the diode matrix card, a coupling system comprising a combination of a plurality of frame-mats for the memory assembly plane piled up in parallel relation to each other and respectively having along peripheral outer edges a surface grounding pattern and along inner edges a printed connection pattern connected to a desired number of memory-driving lines, a pair of grounding angle-bars respectively fixed onto the uppermost and lowermost ones of said frame-mats as electrically connected to said grounding pattern of the mats and having at least one threaded hole for mounting the diode matrix card, a pair of connector means respectively comprising an insulative plate mounted to each said grounding angle-bar and a plurality of connector pins penetrating vertically through said insulative plate to be electrically connected to said printed connection pattern on the frame-mat, a diode matrix card including on one surface of an insulative base plate a group of diode vertically mounted to said base plate and of a corresponding number to the memory-driving lines, a grounding pattern separated from said group of diodes, and a pair of connector-pin groups respectively of a corresponding number to said connector pins in the respective connector means and vertically mounted to the base plate as insulated from said grounding patern at opposing positions to the connector pins in the connector means, and on the other surface of said base plate a printed circuitry pattern to electrically interconnect between a group of terminals of a polarity led out from the group of diodes and one of said pair of connector-pin groups, a plurality of conductor bars to electrically interconnect between the other group of the diode terminals of the other polarity and the other one of said pair of connector-pin groups, and a grounding pattern separated from said printed circuitry pattern, said diode matrix card further having at least a pair of mounting holes at positions opposing to said threaded holes in the grounding angle-bars and penetrating through the grounding patterns on both surfaces of the card, and at least a pair of fixing screws for inserting through respective said mounting holes in the diode matrix card and screwing into said threaded holes in the grounding angle-bars, thereby the diode matrix card will be mounted to the angle-bars, the arrangement being such that, at the same time when the diode matrix card is mounted, the memory-driving lines on said memory assembly plane and the group of diodes corresponding to these lines on the diode matrix card are respectively connected to each other through said groups of connector-pins on said pair of connector means and said groups of connector-pins on the diode matrix card as coupled together, and the both grounding patterns on both surfaces of the diode matrix card are electrically connected to each other by means of the mounting screws inserted to the mounting holes in the card, and also to the grounding patterns on the memory assembly plane frame-mats through the mounting screws and the grounding angle-bars.

Claim 4

In the memory stack comprising the memory assembly plane and the diode matrix card, a coupling system comprising a combination of a plurality of frame-mats for the memory assembly plane piled up in parallel relation to each other and respectively having along peripheral outer edges a surface grounding pattern and along inner edges a printed connection pattern connected to a desired number of memory-driving lines, a pair of grounding angle-bars respectively fixed onto the uppermost and lowermost ones of said frame-mats as electrically connected to said grounding pattern of the mats and having at least one threaded hole for mounting the diode matrix card, a pair of connector means respectively comprising an insulative plate mounted to each said grounding angle-bar and a plurality of connector pins penetrating vertically through said insulative plate to be electrically connected to said printed connection pattern on the frame-mat, a diode matrix card including on one surface of an insulative base plate a group of diode vertically mounted to said base plate and of a corresponding number to the memory-driving lines, a grounding pattern separated from said group of diodes, and a pair of connector-pin groups respectively of a corresponding number to said connector pins in the respective connector means and vertically mounted to the base plate as insulated from said grounding patern at opposing positions to the connector pins in the connector means, and on the other surface of said base plate a printed circuitry pattern to electrically interconnect between a group of terminals of a polarity led out from the group of diodes and one of said pair of connector-pin groups, a plurality of conductor bars to electrically interconnect between the other group of the diode terminals of the other polarity and the other one of said pair of connector-pin groups, and a grounding pattern separated from said printed circuitry pattern, said diode matrix card further having at least a pair of mounting holes at positions opposing to said threaded holes in the grounding angle-bars and penetrating through the grounding patterns on both surfaces of the card, and at least a pair of fixing screws for inserting through respective said mounting holes in the diode matrix card and screwing into said threaded holes in the grounding angle-bars, thereby the diode matrix card will be mounted to the angle-bars, the arrangement being such that, at the same time when the diode matrix card is mounted, the memory-driving lines on said memory assembly plane and the group of diodes corresponding to these lines on the diode matrix card are respectively connected to each other through said groups of connector-pins on said pair of connector means and said groups of connector-pins on the diode matrix card as coupled together, and the both grounding patterns on both surfaces of the diode matrix card are electrically connected to each other by means of the mounting screws inserted to the mounting holes in the card, and also to the grounding patterns on the memory assembly plane frame-mats through the mounting screws and the grounding angle-bars.

Claim 5

In the memory stack comprising the memory assembly plane and the diode matrix card, a coupling system comprising a combination of a plurality of frame-mats for the memory assembly plane piled up in parallel relation to each other and respectively having along peripheral outer edges a surface grounding pattern and along inner edges a printed conncection pattern connected to a desired number of memory-driving lines, a pair of substantially U-shaped grounding angle-bars respectively fixed onto the uppermost and lowermost ones of said frame-mats as electrically connected to said grounding pattern of the mats and having at least one threaded hole for mounting the diode matrix card, a pair of connector means respectively comprising an insulative plate mounted to each said grounding angle-bar and a plurality of connector pins penetrating vertically through said insulative plate to be electrically connected to said printed connection pattern on the frame-mat, said connector means having respectively at least a guide member extruding from a side opposite to the memory assembly plane, a diode matrix card including on one surface of an insulative base plate a group of diode vertically mounted to said base plate in a plurality of rows and of a corresponding number to the memory-driving lines, a grounding pattern separated from said group of diodes, and a pair of connector-pin groups respectively of a corresponding number to said connector pins in the respective connector means and vertically mounted to the base plate as insulated from said grounding patern at opposing positions to the connector pins in the connector means, and on the other surface of said base plate a printed circuitry pattern to electrically interconnect between a group of terminals of a polarity led out from the group of diodes and one of said pair of connector-pin groups, a plurality of conductor bars to electrically interconnect between the other group of the diode terminals of the other polarity and the other one of said pair of connector-pin groups, and a grounding pattern separated from said printed circuitry pattern, said diode matrix card further having at least a pair of mounting holes at positions opposing to said threaded holes in the grounding angle-bars and penetrating through the grounding patterns on both surfaces of the card and at least a pair of engaging holes at corresponding positions to said guide members in the pair of connector means for engaging the members therein, and at least a pair of fixing screws for inserting through respective said mounting holes in the diode matrix card and screwing into said threaded holes in the grounding angle-bars, thereby the diode matrix card will be mounted to the angle-bars, the arrangement being such that, when the diode matrix card is mounted to the memory assembly plane, the extruded guide members of the connector means are inserted to the corresponding engaging holes in the card so as to guide the latter to the predetermined mounting position, the memory-driving lines on said memory assembly plane and the group of diodes corresponding to these lines on the diode matrix card are respectively simultaneously connected to each other through said groups of connector-pins on said pair of connector means and said groups of connector-pins on the diode matrix card as coupled together, and the both grounding patterns on both surfaces of the diode matrix card are electrically connected to each other by means of the mounting screws inserted to the mounting holes in the card, and also to the grounding patterns on the memory assembly plane frame-mats through the mounting screws and the grounding angle-bars.

Claim 6

In the memory stack comprising the memory assembly plane and the diode matrix card, a coupling system comprising a combination of a plurality of frame-mats for the memory assembly plane piled up in parallel relation to each other and respectively having along peripheral outer edges a surface grounding pattern and along inner edges a printed conncection pattern connected to a desired number of memory-driving lines, a pair of substantially U-shaped grounding angle-bars respectively fixed onto the uppermost and lowermost ones of said frame-mats as electrically connected to said grounding pattern of the mats and having at least one threaded hole for mounting the diode matrix card, a pair of connector means respectively comprising an insulative plate mounted to each said grounding angle-bar and a plurality of connector pins penetrating vertically through said insulative plate to be electrically connected to said printed connection pattern on the frame-mat, said connector means having respectively at least a guide member extruding from a side opposite to the memory assembly plane, a diode matrix card including on one surface of an insulative base plate a group of diode vertically mounted to said base plate in a plurality of rows and of a corresponding number to the memory-driving lines, a grounding pattern separated from said group of diodes, and a pair of connector-pin groups respectively of a corresponding number to said connector pins in the respective connector means and vertically mounted to the base plate as insulated from said grounding patern at opposing positions to the connector pins in the connector means, and on the other surface of said base plate a printed circuitry pattern to electrically interconnect between a group of terminals of a polarity led out from the group of diodes and one of said pair of connector-pin groups, a plurality of conductor bars to electrically interconnect between the other group of the diode terminals of the other polarity and the other one of said pair of connector-pin groups, and a grounding pattern separated from said printed circuitry pattern, said diode matrix card further having at least a pair of mounting holes at positions opposing to said threaded holes in the grounding angle-bars and penetrating through the grounding patterns on both surfaces of the card and at least a pair of engaging holes at corresponding positions to said guide members in the pair of connector means for engaging the members therein, and at least a pair of fixing screws for inserting through respective said mounting holes in the diode matrix card and screwing into said threaded holes in the grounding angle-bars, thereby the diode matrix card will be mounted to the angle-bars, the arrangement being such that, when the diode matrix card is mounted to the memory assembly plane, the extruded guide members of the connector means are inserted to the corresponding engaging holes in the card so as to guide the latter to the predetermined mounting position, the memory-driving lines on said memory assembly plane and the group of diodes corresponding to these lines on the diode matrix card are respectively simultaneously connected to each other through said groups of connector-pins on said pair of connector means and said groups of connector-pins on the diode matrix card as coupled together, and the both grounding patterns on both surfaces of the diode matrix card are electrically connected to each other by means of the mounting screws inserted to the mounting holes in the card, and also to the grounding patterns on the memory assembly plane frame-mats through the mounting screws and the grounding angle-bars.

Claim 7

A coupling system for the memory assembly plane and the diode matrix card according to claim 3, wherein said printed connection pattern for memory-driving lines on the frame-mat is provided on each of upper and lower surfaces of the mat for connection to desired driving lines, respectively, said connector-pins in said pair of connector means are arranged in two upper and lower rows, the upper row of which being at corresponding position to said printed connection pattern on the upper surface of the mat and the lower row of which being at corresponding position to said printed connection pattern on the lower surface of the mat, and said pair of connector-pin groups on the diode matrix card are respectively arranged in two upper and lower rows so as to oppose respectively to said upper and lower rows of the connector-pins in the pair of connector means, so that when the memory stack is assemblEd the connector-pins on the diode matrix card are respectively coupled to opposing connector-pins in the connector means for electric connection, thereby a desired electric circuit of the memory stack is simultaneously established.