Method for integrated circuit mask fabrication and assembly used therewith

Abstract

Abstract A METHOD FOR INTEGRATED CIRCUIT MASK FABRICATION. AFTER THE INTEGRATED CIRCUIT HAS BEEN DESIGNED, THE MASKS FOR MAKING THE INTEGRATED CIRCUITS ARE PREPARED BY PREPARING A NUMBER OF NEGATIVES AND POSITIVES FROM THE CIRCUIT WHICH HAS BEEN DESIGNED. EACH OF THE NEGATIVES OR POSITIVES IS MODIFIED BY PASTE-INS, CUT-OUTS, INK-INS OR ERASURES TO PROVIDE ON THE NEGATIVE OR THE POSITIVE THE PATTERN FOR THE PARTICULAR MASK DESIRED. IN THE METHOD, NO CRITICAL DIMENSION NEED BE ADHERED TO FOR MODIFYING THE NEGATIVES OR POSITIVES BECAUSE EACH NEGATIVE IS AUTOMATICALLY RELATED TO THE OTHER. ALL CRITICAL PERIMETERS OR LOCATION EDGES FOR THE CIRCUIT ARE ACCURATELY REPRODUCED IN ACCORDANCE WITH THE ORIGINAL FROM WHICH THE NEGATIVE OR POSITIVE WAS PREPARED. THE LINES WHICH FORM THE CIRCUIT ARE WIDE ENOUGH SO THAT NON-CRITICAL HAND PASTE-INS, INK-INS, ERASURES AND THE LIKE CAN BE UTILIZED. EACH MODIFIED NEGATIVE IS CONVERTED TO A POSITIVE. THESE POSITIVES AND ANY CONVERTED POSITIVES CAN THEN BE PHOTOGRAPHED BY THE USE OF A CONVENTIONAL REDUCTION AND STEP AND REPEAT PROCESSES TO PROVIDE THE ACTUAL MASKS WHICH ARE UTILIZED IN FABRICATING INTEGRATED CIRCUITS.

Inventors

• 👤 David Kleitman
• 👤 Lewis K Russell
• 👤 Alan B Grebene

Bibliographic Details