Patent US3665592A successfully refreshed from Google Patents.
← Back to Patent Explorer
US3665592A Expired / Lapsed US ⏱️ 0.0 years remaining

Ceramic package for an integrated circuit

Assignee: Vernitron Corp
•
Filing: 1970-03-18
•
Granted: 1972-05-30
•
Expires: 1990-03-18
📄 Original PDF 🌐 Google Patents 🔄 Sync Now

Abstract

Abstract A ceramic package for an integrated circuit includes a ceramic plate having a central recess. A screened circuit pattern of spaced conductive stripes of molybdenum manganese is applied to the plate and fired to metallize it. A coating of aluminum oxide is applied over the plate and parts of the stripes and a ring of molybdenum manganese is placed on the coating to surround the recess and inner ends of the stripes. The ring is metalized and then a ''''Kovar'''' ring is brazed to the metalized ring. An integrated circuit chip is placed in the recess and covered by a cover hermetically bonded to the ring.

Inventors

  • 👤 Nick J Apospors

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-24 21:47
CPC Classifications
H; H10; H10W; H10W95/00; H10W70/00; H10W70/01; H10W70/05; H10W70/098; H10W70/40; H10W70/479; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121; Y10T29/49124; Y10T29/4913

Claims Analysis

Total Claims: 2
Claim 1
Independent Claim 49 words
A method as defined in claim 1, comprising the further steps of bonding a metallic ring to said molybdenum manganese ring and bonding circuit terminal lugs to the outer ends of said stripes and plating said lugs, ends of the stripes, and said metallic ring with a noncorrosive metal.
Claim 2
Dependent Claim 85 words
A method as defined in claim 2, comprising the further steps of placing an integrated circuit chip in said recess with the terminals of the integrated circuit chip contacting terminals in said recess whereby the terminals of the integrated circuit are electrically continuous with the inner ends of said strips inside said metallic ring; placing a ceramic disk having another metallic ring bonded to it over the first named ring; and bonding the two rings together to enclose said chip in a hermetically sealed chamber.

References Cited (Backward Citations)

US3187083A Cited
US3544857A Cited
US3495023A Cited
US3550766A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1975-05-30 1975-11-29 1976-05-30 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1979-05-30 1979-11-29 1980-05-30 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1983-05-30 1983-11-29 1984-05-30 $7700.00 Window Closed / Lapsed

Assigned Categories & Tags

No categories assigned to this patent yet.

Assign Category Tag