Patent US3665256A successfully refreshed from Google Patents.
US3665256A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Heat dissipation for power integrated circuits
Assignee: RCA Corp
•
Filing: 1968-10-15
•
Granted: 1972-05-23
•
Expires: 1988-10-15
Abstract
Abstract An integrated circuit chip having circuit elements capable of relatively high power operation is encapsulated in a body of polymeric material having the form of an elongated rectangular prism. Conductors are electrically coupled to the elements in the integrated circuit chip and extend outwardly of the body of polymeric material through its relatively long sides. Heat conductors thermally coupled to the integrated circuit chip extend outwardly of the package through the same sides as the electrical conductors and are adapted to couple the integrated circuit chip to an external heat dispersing means.
Inventors
- 👤 Nathan M Goun
- 👤 Carl F Wheately Jr
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 16:46
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/0201; H05K1/0203; H10; H10W; H10W70/00; H10W70/40; H10W70/461; H10W74/00; H10W74/01; H10W74/016; H05K2201/00; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10659; H05K2201/10689; H10W72/00; H10W72/50; H10W72/541; H10W72/5449; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
152 words
An electrical assembly comprising: a circuit board having a nonconductive substrate and a plurality of electrical conductors thereon, a semiconductor device mounted on said circuit board, said semiconductor device having an elongated body of polymeric material with a pair of relatively long sides and a pair of relatively short ends, a plurality of leads emerging from each of said sides and extending into contact with said electrical conductors on said circuit board, a pad of heat conductive material embedded within said body, a semiconductor chip on said pad in thermal contact therewith, means electrically connecting active areas on said semiconductor chip with said leads, and at least one heat conductor thermally coupled to said pad and emerging from said body through a relatively long side thereof, and a relatively broad area heat dispersing means comprising a body of heat conductive material, said heat dispersing means being thermally coupled to said heat conductor.
Claim 2
Dependent Claim
152 words
An electrical assembly comprising: a circuit board having a nonconductive substrate and a plurality of electrical conductors thereon, a semiconductor device mounted on said circuit board, said semiconductor device having an elongated body of polymeric material with a pair of relatively long sides and a pair of relatively short ends, a plurality of leads emerging from each of said sides and extending into contact with said electrical conductors on said circuit board, a pad of heat conductive material embedded within said body, a semiconductor chip on said pad in thermal contact therewith, means electrically connecting active areas on said semiconductor chip with said leads, and at least one heat conductor thermally coupled to said pad and emerging from said body through a relatively long side thereof, and a relatively broad area heat dispersing means comprising a body of heat conductive material, said heat dispersing means being thermally coupled to said heat conductor.
Claim 3
Dependent Claim
31 words
An electrical assembly as defined in claim 1 wherein said heat dispersing means comprises a relatively broad area foil disposed on and supported by said nonconductive substrate of said circuit board.
Claim 4
Dependent Claim
38 words
An electrical assembly as defined in claim 1 wherein said heat dispersing means comprises a plate of heat conductive material disposed adjacent to said body of said semiconductor device, said heat conductor being thermally coupled to said plate.
References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1975-05-23 | 1975-11-22 | 1976-05-23 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1979-05-23 | 1979-11-22 | 1980-05-23 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1983-05-23 | 1983-11-22 | 1984-05-23 | $7700.00 | Window Closed / Lapsed |