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US3664933A Expired / Lapsed US ⏱️ 0.0 years remaining

Process for acid copper plating of zinc

Assignee: FIRST CITY NATIONAL BANK OF MIDLAND
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Filing: 1969-05-19
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Granted: 1972-05-23
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Expires: 1989-05-19
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Abstract

Abstract A process for the acid copper plating of zinc, particularly complex zinc parts having recessed areas, wherein a displacement copper deposit is formed on the zinc surface by treatment with an immersion copper plating bath and, thereafter, the thus-plated surface is electroplated with copper from an acid copper electroplating bath.

Inventors

  • 👤 Richard J Clauss

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-28 23:35
CPC Classifications
C; C23; C23C; C23C18/00; C23C18/16; C23C18/31; C23C18/38; C25; C25D; C25D5/00; C25D5/34

Claims Analysis

Total Claims: 5
Claim 1
Independent Claim 52 words
The process as claimed in claim 1 wherein subsequent to the formation of the displacement copper deposit on the zinc surface and prior to the copper electrodeposit from the acid copper plating bath, the surface is treated with an immersion nickel plating bath to form a displacement nickel deposit on the surface.
Claim 2
Dependent Claim 102 words
The process as claimed in claim 2 wherein the immersion copper plating bath is an aqueous solution comprising from about 8 to 30 grams per liter of copper supplied by a water soluble copper salt, from about 30 to 350 grams per liter of a primary complexing agent for cupric ions, from about 5 to 80 grams per liter of an alkali metal hydroxide, from about 5 to 70 grams per liter of an accelerator selected from alkali metal chlorides and from about 0.2 to 5 grams per liter of a secondary complexing agent selected from alkali metal cyanides and ammonium hydroxide.
Claim 3
Dependent Claim 37 words
The process as claimed in claim 3 wherein the water soluble copper salt is copper sulfate, the primary complexing agent is sodium gluconate and the accelerator is sodium chloride and the secondary complexing agent is sodium cyanide.
Claim 4
Dependent Claim 155 words
A process for the copper electroplating of complex zinc die castings having recessed areas which comprises applying an electrolytic copper strike to the zinc surface to be treated, treating the thus strike plated zinc surface with an immersion copper plating bath which is an aqueous solution comprising from about 8 to 30 grams per liter of copper supplied by a water soluble copper salt, from about 30 to 350 grams per liter of a primary complexing agent for cupric ions, from about 5 to 80 grams per liter of an alkali metal hydroxide, from about 5 to 70 grams per liter of an accelerator selected from alkali metal chlorides and 0.2 to 5 grams per liter of a secondary complexing agent selected from alkali metal cyanides and ammonium hydroxide, forming a displacement copper deposit on the uncoated, recessed, zinc surface and, thereafter, electrodepositing copper on the thus treated surfaces from aqueous acidic copper electroplating bath.
Claim 5
Dependent Claim 40 words
The process as claimed in claim 5 wherein the water soluble copper salt is copper sulfate, the primary complexing agent for cupric ions is sodium gluconate and the accelerator is sodium chloride and the secondary complexing agent is sodium cyanide.

References Cited (Backward Citations)

US43557A Cited
US2128550A Cited
US2903403A Cited
GB792847A Cited
FR1288498A Cited
US3282659A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1975-05-23 1975-11-22 1976-05-23 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1979-05-23 1979-11-22 1980-05-23 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1983-05-23 1983-11-22 1984-05-23 $7700.00 Window Closed / Lapsed

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