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US3661761A Expired / Lapsed US ⏱️ 0.0 years remaining

Rf sputtering apparatus for promoting resputtering of film during deposition

Assignee: International Business Machines Corp
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Filing: 1969-06-02
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Granted: 1972-05-09
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Expires: 1989-06-02
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Abstract

Abstract An RF sputtering method and apparatus wherein the area ratio of the substrate holder electrode to the target holder electrode is less than 2.5 and the region of the glow discharge is confined to promote resputtering, which improves the over-all quality of the resultant sputtered film.

Inventors

  • 👤 Harold R Koenig

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-25 07:34
CPC Classifications
H; H01; H01J; H01J37/00; H01J37/32; H01J37/34; C; C23; C23C; C23C14/00; C23C14/22; C23C14/34

Claims Analysis

Total Claims: 0
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References Cited (Backward Citations)

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USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1975-05-09 1975-11-08 1976-05-09 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1979-05-09 1979-11-08 1980-05-09 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1983-05-09 1983-11-08 1984-05-09 $7700.00 Window Closed / Lapsed

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