US3661761A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Rf sputtering apparatus for promoting resputtering of film during deposition
Assignee: International Business Machines Corp
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Filing: 1969-06-02
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Granted: 1972-05-09
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Expires: 1989-06-02
Abstract
Abstract An RF sputtering method and apparatus wherein the area ratio of the substrate holder electrode to the target holder electrode is less than 2.5 and the region of the glow discharge is confined to promote resputtering, which improves the over-all quality of the resultant sputtered film.
Inventors
- 👤 Harold R Koenig
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-25 01:05
CPC Classifications
H; H01; H01J; H01J37/00; H01J37/32; H01J37/34; C; C23; C23C; C23C14/00; C23C14/22; C23C14/34
Claims Analysis
Total Claims: 0
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References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1975-05-09 | 1975-11-08 | 1976-05-09 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1979-05-09 | 1979-11-08 | 1980-05-09 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1983-05-09 | 1983-11-08 | 1984-05-09 | $7700.00 | Window Closed / Lapsed |