Patent US3656232A successfully refreshed from Google Patents.
US3656232A
Expired / Lapsed
US
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Method of encapsulating coplanar microelectric system
Assignee: Singer Co
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Filing: 1969-05-28
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Granted: 1972-04-18
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Expires: 1989-05-28
Abstract
Abstract Microelectronic units such as integrated-circuit chips equipped with heat-conducting extensions, and also terminal pins, are sealed and bonded, face down, on a transparent mold board, precisely located with respect to gauge marks on the upper surface by observation from below, and embedded flush, or coplanar, with the surface of a cast encapsulating block such as ceramic or epoxy. Insulating interconnecting conductors are formed on the coplanar surface of said block and embedded microelectronic units.
Inventors
- 👤 John F Hinchey
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-26 04:44
CPC Classifications
H; H10; H10W; H10W99/00; H10W70/00; H10W70/60; H10W70/611; H10W70/62; H10W70/63; H10W70/635; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49131; Y10T29/49146; Y10T29/49764; Y10T29/49778; Y10T29/4978
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
247 words
The method of fabricating an array of microelectronic units, each unit having a plurality of conductor portions on a single surface only, comprising the steps of: a. providing a mold having a substantially planar transparent surface overlaying a mirror and surrounded by a frame portion; b. positioning each of said units on said substantially planar surface of said mold by i. marking said substantially planar surface of said transparent member with reference marks for each of said units; ii. positioning said single surface of each of said units closely adjacent said substantially planar surface; iii. observing the reflected images of said marks and said each of said units from said mirror; iv. adjusting the position of each of said units until said images of said marks and predetermined portions of said each of said units are coincident; v. placing each of said units on said substantially planar surface; c. adhesing said single surface of each of said units to said substantially planar surface of said mold to provide a seal therebetween; d. forming a cast block having a substantially continuous planar surface comprising said single surfaces and the cast surface of a bonding agent by i. filling said mold to a depth substantially greater than the thickness of each said unit with a settable electrically nonconductive encapsulating agent, and ii. allowing said agent to harden; e. removing said mold surface to expose said substantially continuous planar surface; and f. electrically interconnecting selected ones of said conductor portions.
Claim 2
Independent Claim
247 words
The method of fabricating an array of microelectronic units, each unit having a plurality of conductor portions on a single surface only, comprising the steps of: a. providing a mold having a substantially planar transparent surface overlaying a mirror and surrounded by a frame portion; b. positioning each of said units on said substantially planar surface of said mold by i. marking said substantially planar surface of said transparent member with reference marks for each of said units; ii. positioning said single surface of each of said units closely adjacent said substantially planar surface; iii. observing the reflected images of said marks and said each of said units from said mirror; iv. adjusting the position of each of said units until said images of said marks and predetermined portions of said each of said units are coincident; v. placing each of said units on said substantially planar surface; c. adhesing said single surface of each of said units to said substantially planar surface of said mold to provide a seal therebetween; d. forming a cast block having a substantially continuous planar surface comprising said single surfaces and the cast surface of a bonding agent by i. filling said mold to a depth substantially greater than the thickness of each said unit with a settable electrically nonconductive encapsulating agent, and ii. allowing said agent to harden; e. removing said mold surface to expose said substantially continuous planar surface; and f. electrically interconnecting selected ones of said conductor portions.
Claim 3
Dependent Claim
23 words
The method of claim 1 wherein said step of adhesing includes the step of coating said substantially planar surface with an adhesive fluid.
Claim 4
Dependent Claim
27 words
The method of claim 1 further including the step of providing said mold with a plurality of gauge points for use in said step of electrically interconnecting.
Claim 5
Dependent Claim
23 words
The method of claim 1 wherein said step of marking includes the step of providing individual reference marks for said electrical conductor portions.
Claim 6
Dependent Claim
29 words
The method of claim 1 further including the step of bonding a thermally conductive member to a second surface of individual ones of at least some of said units.
Claim 7
Dependent Claim
25 words
The method of claim 5 wherein said step of bonding includes the step of forming a eutectic bond between said member and said second surface.
Claim 8
Dependent Claim
31 words
The method of claim 1 wherein said step of electrically interconnecting includes the step of clearing said substantially continuous planar surface to remove any electrically nonconductive substances from said conductor portions.
Claim 9
Dependent Claim
35 words
The method of claim 1 wherein said step of electrically interconnecting includes the step of depositing predetermined alternate patterned layers of insulating and conducting materials on said substantially continuous planar surface of said cast block.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1975-04-18 | 1975-10-18 | 1976-04-18 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1979-04-18 | 1979-10-18 | 1980-04-18 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1983-04-18 | 1983-10-18 | 1984-04-18 | $7700.00 | Window Closed / Lapsed |