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US3655540A Expired / Lapsed US ⏱️ 0.0 years remaining

Method of making semiconductor device components

Assignee: AT&T Inc
•
Filing: 1970-06-22
•
Granted: 1972-04-11
•
Expires: 1990-06-22
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Abstract

Abstract Extremely thin semiconductor wafers are formed by growing an Nconductivity epitaxial layer on an N -type substrate. A Schottky barrier contact is formed on the epitaxial layer and the assembly is immersed in an appropriate fluid for electrolytic etching. Because of differential etch rates as a function of conductivity, and with an appropriate contact voltage, the substrate is selectively dissolved, leaving only the thin epitaxial layer adhered to the contact. The contact is then removed, leaving the epitaxial layer as an independent ultrathin wafer.

Inventors

  • 👤 John Calhoun Irvin

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-02 17:52
CPC Classifications
H; H10; H10P; H10P50/00; H10P50/60; H10P50/61; H10P50/613; Y; Y10; Y10S; Y10S148/00; Y10S148/051; Y10S148/117; Y10S148/135; Y10S438/00; Y10S438/977

Claims Analysis

Total Claims: 5
Claim 1
Independent Claim 37 words
The method of claim 1 wherein: the wafer is silicon and the step of forming a thin layer comprises the step of epitaxially growing a thin layer of silicon having a significantly higher resistivity than the substrate.
Claim 2
Dependent Claim 46 words
The method of claim 2 wherein: the step of forming a Schottky barrier contact on the layer comprises the step of evaporating metal onto the layer; and further comprising the step of removing the contact comprising the step of selectively etching the metal from the layer.
Claim 3
Dependent Claim 36 words
The method of claim 2 wherein: the step of forming a Schottky barrier contact comprises the step of coating the layer with a conductive adhesive; and forcing a flat metal contact against the adhesive under pressure.
Claim 4
Dependent Claim 30 words
The method of claim 2 wherein: the electrolyte is hydrofluoric acid; and the step of sealing the periphery comprises the step of covering the periphery of the substrate with wax.
Claim 5
Dependent Claim 33 words
The method of claim 2 wherein the semiconductor layer and the semiconductor substrate are of N-type conductivity; and the step of applying a voltage comprises the step of forward-biasing the Schottky barrier contact.

References Cited (Backward Citations)

US2656496A Cited
US3096262A Cited
US3536600A Cited
US3550260A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1975-04-11 1975-10-11 1976-04-11 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1979-04-11 1979-10-11 1980-04-11 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1983-04-11 1983-10-11 1984-04-11 $7700.00 Window Closed / Lapsed

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