Patent US3645772A successfully refreshed from Google Patents.
US3645772A
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Process for improving bonding of a photoresist to copper
Assignee: EIDP Inc
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Filing: 1970-06-30
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Granted: 1972-02-29
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Expires: 1990-06-30
Abstract
Abstract A process for improving the bonding of photoresist layers to copper surfaces by exposing the copper surface to the action of a nitrogen-containing organic compound containing at least one other hetero-atom and at least one five- or six-membered ring. A photoresist layer is then applied to the treated copper surface. Ethanol and other solutions of the nitrogen-containing compounds are effective.
Inventors
- 👤 John Lester William Jones
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-25 18:53
CPC Classifications
G; G03; G03F; G03F7/00; G03F7/004; G03F7/09; G03F7/11; B; B44; B44C; B44C1/00; B44C1/22; B44C1/227; H; H05; H05K; H05K3/00; H05K3/38; H05K3/389; H05K3/10; H05K3/108; H05K3/382
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
17 words
A process as set forth in claim 1, wherein the nitrogen-containing organic compound is in a solution.
Claim 2
Dependent Claim
18 words
A process as set forth in claim 1, wherein the nitrogen-containing organic compound is in an ethanol solution.
Claim 3
Dependent Claim
21 words
A process as set forth in claim 1, wherein the nitrogen-containing organic compound is in a dilute solution of hydrochloric acid.
Claim 4
Dependent Claim
18 words
A process as set forth in claim 1, wherein the nitrogen-containing organic compound is in a 1,1,2-trichloroethylene solution.
Claim 5
Dependent Claim
21 words
A process according to claim 1, wherein between steps (a) and (b) the surface of the copper is rinsed with water.
Claim 6
Dependent Claim
21 words
A process according to claim 1, wherein the organic nitrogen-containing compound is applied in a solution for 10 to 60 seconds.
Claim 7
Dependent Claim
35 words
A process according to claim 1, wherein the bond provided between the photoresist and the copper surface is more resistant to chemical attack by electroplating electrolytes than the bond between the photoresist and untreated copper.
References Cited (Backward Citations)
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Cited
US3305416A
Cited
GB1152368A
Cited
US3479185A
Cited
US3434889A
Cited
US3447965A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1975-02-28 | 1975-08-30 | 1976-02-29 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1979-02-28 | 1979-08-30 | 1980-02-29 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1983-02-28 | 1983-08-30 | 1984-02-29 | $7700.00 | Window Closed / Lapsed |