Reusable circuit board for constructing logic circuits using integrated circuit elements

Claim 2

A reusable circuit board for designing logic structures utilizing integrated circuits comprising, in combination: an insulative material having a planar surface; first and second sets of pins vertically mounted on said planar surface; connecting means on said planar surface interconnecting selected ones of the pins of said first set to selected ones of the pins of said second set; a removable component assembly including a connector having a plurality of apertures formed therein and a multilead integrated circuit package mounted on said connector, each of said apertures receiving a lead from said circuit package and one pin of said first set of pins to form an electrical coNnection therebetween; and a plurality of conductors wrapped to selected pins of said second set of pins to apply electrical signals and electrical potentials to said integrated circuit package for designing a logic structure.

Claim 3

A reusable circuit board for designing electronic circuits comprising, in combination: an insulative material having a planar surface; a plurality of first pins vertically mounted on said planar surface; a plurality of second pins equal in number to the number of said first pins vertically mounted on said planar surface adjacent said first pins; a plurality of third pins vertically mounted on said planar surface; a plurality of contact means for receiving external electrical signals and potentials, said contact means formed on said planar surface and connected to said plurality of third pins; means electrically connecting individual ones of said first pins to corresponding ones of said second pins; a multilead integrated circuit package; an integrated circuit connector having a plurality of apertures formed therein, each of said apertures receiving a lead of said integrated circuit package and one of said first pins to form an electrical connection therebetween; and electrical conductors selectively wrap connected to and interconnecting said plurality of second pins, electrical conductors selectively wrap connected to and between said second pins and said third pins to apply the electrical signals and electrical potentials to said multilead integrated circuit package to form an electronic circuit, all of said conductors lying below the upper extremities of said first, second, and third pins.

Claim 4

A reusable circuit board for designing electronic circuits comprising, in combination: an insulative material having a planar surface; a plurality of first pins vertically mounted on said planar surface; a plurality of second pins equal in number to the number of said first pins vertically mounted on said planar surface adjacent said first pins; a plurality of third pins vertically mounted on said planar surface; a plurality of contact means for receiving external electrical signals and potentials, said contact means formed on said planar surface and connected to said plurality of third pins; means electrically connecting individual ones of said first pins to corresponding ones of said second pins; a multilead integrated circuit package; an integrated circuit connector having a plurality of apertures formed therein, each of said apertures receiving a lead of said integrated circuit package and one of said first pins to form an electrical connection therebetween; and electrical conductors selectively wrap connected to and interconnecting said plurality of second pins, electrical conductors selectively wrap connected to and between said second pins and said third pins to apply the electrical signals and electrical potentials to said multilead integrated circuit package to form an electronic circuit, all of said conductors lying below the upper extremities of said first, second, and third pins.

Claim 5

The circuit board of claim 2 in which a portion of the leads of said multilead integrated circuit package extending through said apertures are bent around said integrated circuit connector to join said package and said connector to form a removable assembly.

Claim 6

A reusable circuit board for designing electronic circuits comprising, in combination: an insulative material having oppositely disposed sides; first, second and third sets of pins mounted on one of said sides, said third set of pins connected to external electrical signals and electrical potentials; means electrically connecting individual ones of the pins of said first set to corresponding ones of the pins of said second set; a removable assembly mounting and electrically connecting a multilead integrated circuit package to said first set of pins, said assembly including the multilead integrated circuit package and a connector having apertures formed therein equal in number to the number of connecting pins in said first set, each of said apertures receiving a lead from said circuit package and a pin of said first set to form an electrical connection therebetween; and electrical conductors selectively wrap connected to and interconnecting said second set of pins, electrical conductors selectively wrap connected to and connecting said third set of pins to said second set of pins to apply the electrical signals and the electrical potentials to said multilead integrated circuit package to form an electronic circuit, all of said conductors lying below the upper extremities of said removable assembly and said first, second and third sets of pins.

Claim 7

A reusable circuit board for designing electronic circuits comprising, in combination: an insulative material having oppositely disposed sides; first, second and third sets of pins mounted on one of said sides, said third set of pins connected to external electrical signals and electrical potentials; means electrically connecting individual ones of the pins of said first set to corresponding ones of the pins of said second set; a removable assembly mounting and electrically connecting a multilead integrated circuit package to said first set of pins, said assembly including the multilead integrated circuit package and a connector having apertures formed therein equal in number to the number of connecting pins in said first set, each of said apertures receiving a lead from said circuit package and a pin of said first set to form an electrical connection therebetween; and electrical conductors selectively wrap connected to and interconnecting said second set of pins, electrical conductors selectively wrap connected to and connecting said third set of pins to said second set of pins to apply the electrical signals and the electrical potentials to said multilead integrated circuit package to form an electronic circuit, all of said conductors lying below the upper extremities of said removable assembly and said first, second and third sets of pins.

Claim 8

A circuit board as recited in claim 4 wherein said first set of pins is aligned into first and second rows and said second set of pins is juxtapositionally aligned with said first and second rows into third and fourth rows, said third and fourth rows positioned between said first and second rows.

Claim 9

The circuit board of claim 4 in which a portion of the leads of said multilead integrated circuit package extending through said apertures are bent around said integrated circuit connector to form said removable assembly.