Alignment system using an electronic scanner

Claim 1

In a method of utilizing a reference standard to effect a predetermined condition of alignment between a particular area of an object scene and a work implement, the steps of: a. scanning a relatively large area of the object scene and scanning a comparable large area of the reference standard to obtain comparative indicia from which the position of the object scene relative to the reference standard is ascertained; b. effecting on the basis of such comparative indicia relative movement between the object scene and work implement so as to effect more close alignment therebetween; c. scanning progressively smaller areas within said relatively large area of the object scene and scanning comparably smaller areas of the large area of the reference standard at a predetermined rate to obtain with each scan of a progressively smaller Area of the object scene and comparably smaller area of the reference standard further comparative indicia from which the position of the object scene relative to the reference standard is more accurately ascertained; and, after each scan of a progressively smaller area of the object scene and comparably smaller area of the reference standard d. effecting on the basis of said further comparative indicia relative movement between the object scene and work implement until said further comparative indicia indicates that said predetermined condition of alignment is met.

Claim 27

An apparatus utilizing a reference standard for effecting a predetermined condition of alignment between a lead connection area on a semiconductor and a lead connector mechanism operative to connect a lead wire To such connection area comprising: a. a work holder structure for supporting such semiconductor in operative association with the lead connector mechanism, b. a scanning system including a single flying spot scanner for scanning concurrently such semiconductor and reference standard, c. a raster generator connected with said flying spot scanner for developing the scanning raster therefrom, d. a raster size control network connected in the deflection circuit of said flying spot scanner for reducing the size of the scanning raster from a relatively large area including a major area of such semiconductor toward a smaller lead connection area thereon so as to increase the accuracy of alignment of the lead connector mechanism therewith, e. means for progressively changing the size of such raster from the relatively large area toward the smaller lead connection area, f. a pair of optical sensors respectively associated with such semiconductor and reference standard for receiving the scanning light modulated by such semiconductor and reference standard whereby the outputs of said optical sensors constitute video signals providing comparative indicia of the position of the semiconductor elative to the reference standard, and g. a correlator and analyzer unit comprising means for correlating such video signals and deriving therefrom electrical error signals of any misalignment between such semiconductor and reference standard, means for developing from such error signals correction signals from which relative displacements between the semiconductor and lead connector mechanism can be made toward such predetermined condition of alignment, and displacement error correction means for effecting in response to such correction signals relative movement between such semiconductor and lead connector mechanism as necessary to obtain the aforesaid condition of alignment therebetween.

Claim 28

An apparatus utilizing a reference standard for effecting a predetermined condition of alignment between a lead connection area on a semiconductor and a lead connector mechanism operative to connect a lead wire To such connection area comprising: a. a work holder structure for supporting such semiconductor in operative association with the lead connector mechanism, b. a scanning system including a single flying spot scanner for scanning concurrently such semiconductor and reference standard, c. a raster generator connected with said flying spot scanner for developing the scanning raster therefrom, d. a raster size control network connected in the deflection circuit of said flying spot scanner for reducing the size of the scanning raster from a relatively large area including a major area of such semiconductor toward a smaller lead connection area thereon so as to increase the accuracy of alignment of the lead connector mechanism therewith, e. means for progressively changing the size of such raster from the relatively large area toward the smaller lead connection area, f. a pair of optical sensors respectively associated with such semiconductor and reference standard for receiving the scanning light modulated by such semiconductor and reference standard whereby the outputs of said optical sensors constitute video signals providing comparative indicia of the position of the semiconductor elative to the reference standard, and g. a correlator and analyzer unit comprising means for correlating such video signals and deriving therefrom electrical error signals of any misalignment between such semiconductor and reference standard, means for developing from such error signals correction signals from which relative displacements between the semiconductor and lead connector mechanism can be made toward such predetermined condition of alignment, and displacement error correction means for effecting in response to such correction signals relative movement between such semiconductor and lead connector mechanism as necessary to obtain the aforesaid condition of alignment therebetween.