Patent US3639811A successfully refreshed from Google Patents.
US3639811A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor with bonded electrical contact
Assignee: Fairchild Semiconductor Corp
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Filing: 1970-11-19
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Granted: 1972-02-01
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Expires: 1990-11-19
Abstract
Abstract A method is disclosed for batch forming extended beam leads to the pads or contact areas of a solid state device (e.g., monolithic integrated circuit hybrid integrated circuit, discrete device) whereby external connections to the device may be made. The process involves depositing a metal or a plurality of metals over the device in a predetermined manner with the metal adhering to the device contact area but only weakly, if at all, adhering to the remainder of the surface. The device is separated by backside scribing which leaves the beams extending from the contact area of each device.
Inventors
- 👤 Jon M Schroeder
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-06 06:08
CPC Classifications
H; H10; H10P; H10P95/00; H10W; H10W20/00; H10W20/40
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
153 words
An extended beam device comprising a semiconductor chip having a protective insulating layer over most of its upper surface and at least one component therein defining an element of an electrical circuit; a conductive pad associated with said chip, said conductive pad making contact with said component in said semiconductor chip through openings in said insulating layer; and, a conductive beam comprising an extending fiNger of a first material, said finger being superimposed upon said conductive pad and adhering thereto, and nonadhering to the surface of said insulating layer on said chip, said finger extending from said conductive pad and onto the surface of said insulating layer on said semiconductor chip and extending longitudinally beyond the edge of said chip, and a layer of a second material imposed upon said finger of said first material and coincident therewith, said layer adhering to said finger of said first material and forming a laminate therewith.
Claim 2
Dependent Claim
153 words
An extended beam device comprising a semiconductor chip having a protective insulating layer over most of its upper surface and at least one component therein defining an element of an electrical circuit; a conductive pad associated with said chip, said conductive pad making contact with said component in said semiconductor chip through openings in said insulating layer; and, a conductive beam comprising an extending fiNger of a first material, said finger being superimposed upon said conductive pad and adhering thereto, and nonadhering to the surface of said insulating layer on said chip, said finger extending from said conductive pad and onto the surface of said insulating layer on said semiconductor chip and extending longitudinally beyond the edge of said chip, and a layer of a second material imposed upon said finger of said first material and coincident therewith, said layer adhering to said finger of said first material and forming a laminate therewith.
Claim 3
Dependent Claim
21 words
The extended beam device as recited in claim 1 wherein said first material is silver and said second material is aluminum.
Claim 4
Dependent Claim
67 words
A plurality of adjacent extended beam devices adapted to be separated from each other, as recited in claim 1, aligned so that the fingers of one device are interdigitated with the fingers of the adjacent device, a finger extending from a conductive pad on one device falling between two adjacent fingers on the neighboring device whereby, when said devices are separated, the fingers are no longer adjacent.
Claim 5
Dependent Claim
55 words
A device as recited in claim 3 wherein said plurality of devices contains a finite number of scribe lines on the backside surface the scribe lines running approximately perpendicular to the extended fingers, so that when the substrate is separated into chips along the scribe lines, the fingers extend beyond the edge of each chip.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1975-01-31 | 1975-08-02 | 1976-02-01 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1979-01-31 | 1979-08-02 | 1980-02-01 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1983-01-31 | 1983-08-02 | 1984-02-01 | $7700.00 | Window Closed / Lapsed |