Semiconductor device package having improved compatibility properties
Abstract
Abstract A semiconductor device package is provided including a lead frame formed of a first preselected conductive material which is thermally and/or chemically compatible with a support carrier material. The lead frame includes a plurality of exposed leads adapted to be interconnected in an electronic system and a plurality of associated terminals which are integrally joined to the leads by shoulder members and are adapted to be interconnected with a semiconductor device. A semiconductor bonding pad and supporting tie bars extending from opposed ends thereof is formed of a second preselected material which is thermally and/or chemically compatible with the material from which the semiconductor device is formed, and is arranged in spaced relationship with the terminals for supporting the semiconductor device. The tie bars are attached to temporary side members on the lead frame during fabrication of the unit in order to temporarily support the bonding pad in position prior to removal of the supporting side members and the completion of the encapsulation of the package in the support carrier.
Inventors
- 👤 Ashok R Hingorany
Bibliographic Details
Claims Analysis
Total Claims: 2References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1974-12-20 | 1975-06-21 | 1975-12-21 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1978-12-20 | 1979-06-21 | 1979-12-21 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1982-12-20 | 1983-06-21 | 1983-12-21 | $7700.00 | Window Closed / Lapsed |