Patent US3629036A successfully refreshed from Google Patents.
US3629036A
Expired / Lapsed
US
⏱️ 0.0 years remaining
The method coating of photoresist on circuit boards
Assignee: Shipley Co Inc
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Filing: 1969-02-14
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Granted: 1971-12-21
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Expires: 1989-02-14
Abstract
Abstract Circuit board base materials, either with or without a layer of copper, have photoresist applied thereto by means which transport said base material past a transfer station. Means in advance of said station apply a liquid solvent for said photoresist to a surface of base material, and means at said transfer station bring into contact with said solvent-coated base surface, a transfer sheet having a layer of photoresist and a backing layer releasably secured thereto whereby said photoresist layer becomes adhered to said surface. Following the transfer station, means are provided for withdrawing said backing layer from said resist layer, which remains secured to the surface of said base.
Inventors
- 👤 Calvin Isaacson
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-26 17:52
CPC Classifications
G; G03; G03F; G03F7/00; G03F7/16; G03F7/161; B; B32; B32B; B32B37/00; B32B37/0038; H; H05; H05K; H05K3/00; H05K3/0073; H05K3/0079; H05K2203/00; H05K2203/05; H05K2203/0562; H05K2203/0577; H05K2203/06; H05K2203/066; H05K3/02; H05K3/06; H05K3/061; H05K3/064
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
27 words
The method of claim 1 further comprising separating said backing layer from said photoresist layer after it has been adhered to said substrate and prior to exposure.
Claim 2
Dependent Claim
16 words
The method of claim 1 wherein said adhering agent comprises a solvent for said photoresist layer.
Claim 3
Dependent Claim
20 words
The method of claim 1 further comprising adding pressure to said transfer sheet while contacting it to said substrate surface.
Claim 4
Dependent Claim
21 words
The method of claim 1 wherein said application of adhering agent is carried by wicking said agent to said substrate surface.
Claim 5
Dependent Claim
24 words
The method of claim 1 wherein said application of photoresist takes place at a temperature substantially below the temperature at which said photoresist degrades.
Claim 6
Independent Claim
147 words
The method of forming a printed circuit board comprising applying a layer of photoresist to a substrate, said method including the steps of: forming a transfer sheet having a flexible backing layer releasably secured to a layer of light sensitive photoresist; applying a uniform coating of a liquid adhering agent for said photoresist to a surface of said substrate, said adhering agent wetting said substrate surface being in part at least a solvent for said photoresist and being compatible with eventual exposure and development of said photoresist layer; contacting a surface of the photoresist layer on the transfer sheet to the liquid adhering coating on the surface of the substrate thereby softening the contacting surface of said photoresist layer and Bonding the photoresist layer to the substrate surface to form a circuit board, exposing said photoresist layer of the circuit board to a source of activating radiation.
Claim 7
Dependent Claim
27 words
The method of claim 7 further comprising separating said backing layer from said photoresist layer after it has been adhered to said substrate and prior to exposure.
Claim 8
Dependent Claim
25 words
The method of claim 7 further comprising separating said backing layer from said photoresist layer after it has been adhered to said substrate and exposed.
Claim 9
Dependent Claim
14 words
The method of claim 7 where said adhering agent further comprises dissolved photoresist material.
Claim 10
Dependent Claim
20 words
The method of claim 7 further comprising adding pressure to said transfer sheet while contacting it to said substrate surface.
Claim 11
Dependent Claim
24 words
The method of claim 7 wherein said application of photoresist takes place at a temperature substantially below the temperature at which said photoresist degrades.
References Cited (Backward Citations)
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Cited
US3021250A
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US3471357A
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US3256121A
Cited
US3479182A
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1974-12-20 | 1975-06-21 | 1975-12-21 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1978-12-20 | 1979-06-21 | 1979-12-21 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1982-12-20 | 1983-06-21 | 1983-12-21 | $7700.00 | Window Closed / Lapsed |