Fabrication of printed circuit

Claim 1

A method for forming a printed circuit upon a laminate comprising a body consisting of thermoplastic material having bonded thereto a sheet of metal thinner than said body, for forcing against the metal sheet a die having the pattern of the desired circuitry recessed therein and having a projecting pattern of the areas not constituting a part of the desired circuitry, causing the die to travel so as to intrude said projecting pattern through said metal sheet while the thermoplastic material is initially at a temperature at which, under the conditions of said travel, its elastic modulus is sufficiently high that the yield point of the metal sheet in sheeR is exceeded when the die has penetrated to a depth less than the thickness of the metal sheet and its yield point is sufficiently high that the thermoplastic material behaves essentially elastically during its initial deformation under the action of the die, whereby a pattern of the metal sheet corresponding to said projecting pattern is sheared, inwardly into the thermoplastic material, from the remainder of the sheet, which remains as the printed circuit pattern on the surface of the thermoplastic material, and causing the die to travel a further distance to force said sheared pattern of metal still farther into the thermoplastic material until deformation of the thermoplastic material occurs in plastic flow.

Claim 2

A method for forming a printed circuit upon a laminate comprising a body consisting of thermoplastic material having bonded thereto a sheet of metal thinner than said body, for forcing against the metal sheet a die having the pattern of the desired circuitry recessed therein and having a projecting pattern of the areas not constituting a part of the desired circuitry, causing the die to travel so as to intrude said projecting pattern through said metal sheet while the thermoplastic material is initially at a temperature at which, under the conditions of said travel, its elastic modulus is sufficiently high that the yield point of the metal sheet in sheeR is exceeded when the die has penetrated to a depth less than the thickness of the metal sheet and its yield point is sufficiently high that the thermoplastic material behaves essentially elastically during its initial deformation under the action of the die, whereby a pattern of the metal sheet corresponding to said projecting pattern is sheared, inwardly into the thermoplastic material, from the remainder of the sheet, which remains as the printed circuit pattern on the surface of the thermoplastic material, and causing the die to travel a further distance to force said sheared pattern of metal still farther into the thermoplastic material until deformation of the thermoplastic material occurs in plastic flow.

Claim 6

The method of forming printed circuitry from a laminate comprising a body consisting of a thermoplastic material having bonded thereto a thinner sheet of metal, by forcing against the metal sheet a die having the pattern of the desired circuitry recessed therein and having a projecting pattern of the areas not constituting a part of the desired circuitry, causing the die to travel so as to intrude said projecting pattern through said metal sheet while the thermoplastic material is at a temperature not essentially higher than room temperature, whereby a pattern of the metal sheet corresponding to said projecting pattern is sheared inwardly into the thermoplastic composition from the remainder of the sheet, which remains as the printed circuit pattern on the surface of the thermoplastic material, and causing the die to travel a further distance to force said sheared pattern of metal still farther into the thermoplastic material until deformation of the thermoplastic material occurs in plastic flow.

Claim 7

The method of forming printed circuitry from a laminate comprising a body consisting of a thermoplastic material having bonded thereto a thinner sheet of metal, by forcing against the metal sheet a die having the pattern of the desired circuitry recessed therein and having a projecting pattern of the areas not constituting a part of the desired circuitry, causing the die to travel so as to intrude said projecting pattern through said metal sheet while the thermoplastic material is at a temperature not essentially higher than room temperature, whereby a pattern of the metal sheet corresponding to said projecting pattern is sheared inwardly into the thermoplastic composition from the remainder of the sheet, which remains as the printed circuit pattern on the surface of the thermoplastic material, and causing the die to travel a further distance to force said sheared pattern of metal still farther into the thermoplastic material until deformation of the thermoplastic material occurs in plastic flow.