Method of making through-connections by controlled punctures

Claim 1

A METHOD OF FORMING AN ELECTRICAL CONNECTION BETWEEN A PAIR OF CONDUCTIVE LINES ADHERED TO OPPOSITE FACES OF AN INSULATOR BODY COMPRISING: CLEANING ONE FACE OF SAID MEMBER TO REMOVE OXIDE FILM ACCUMULATIONS FROM THE OUTER SURFACES OF CONDUCTIVE LINES ADHERED THERETO, INCLUDING ONE LINE OF SAID PAIR OF LINES; CONTROLLABLY PIERCING AN OPENING EXTENDING THROUGH ONE LINE OF SAID PAIR AND SAID INSULATOR BODY AND TERMINATING AT BUT NOT PENETRATING THE OTHER CONDUCTIVE LINE OF SAID PAIR; EMPLOYING A PERFORATING INSTRUMENT DIMENSIONED TO CAUSE DEFORMATION OF THE MATERIAL OF SAID ONE LINE IN THE PIERCED REGION BEYOND THE ELASTIC LIMIT OF SAID MATERIAL THEREBY DEFORMING SAID LINE TO FORM A RETAINING WALL IN SAID OPENING WHICH WILL TEND TO RETAIN ITS SHAPE UPON REMOVAL OF THE INSTRUMENT; AND DEPOSITING ADDITIONAL CONDUCTIVE MATTER INTO SAID OPENING TO PROVIDE A PERMANENT ELECTRICAL CONNECTION BETWEEN SAID PAIR OF LINES; WHEREIN SAID STEP OF DEPOSITING IS ACCOMPLISHED BY AN ELECTROPLATING PROCESS IN WHICH THE SAID OTHER CONDUCTIVE LINE OF SAID PAIR IS CONNECTED TO ONE TERMINAL OF A SOURCE OF DIRECT CURRENT AND THE OPENING REGION RETAINED BY THE ONE LINE OF SAID PAIR IS CONTROLLABLY EXPOSED THROUGH AN ELECTROPLATING SOLUTION TO AN ELECTRODE OF AN ELECTROPLATING SYSTEM INCLUDING SAID SOURCE AND SAID OTHER LINE.

Claim 2

A METHOD OF FORMING AN ELECTRICAL CONNECTION BETWEEN A PAIR OF CONDUCTIVE LINES ADHERED TO OPPOSITE FACES OF AN INSULATOR BODY COMPRISING: CLEANING ONE FACE OF SAID MEMBER TO REMOVE OXIDE FILM ACCUMULATIONS FROM THE OUTER SURFACES OF CONDUCTIVE LINES ADHERED THERETO, INCLUDING ONE LINE OF SAID PAIR OF LINES; CONTROLLABLY PIERCING AN OPENING EXTENDING THROUGH ONE LINE OF SAID PAIR AND SAID INSULATOR BODY AND TERMINATING AT BUT NOT PENETRATING THE OTHER CONDUCTIVE LINE OF SAID PAIR; EMPLOYING A PERFORATING INSTRUMENT DIMENSIONED TO CAUSE DEFORMATION OF THE MATERIAL OF SAID ONE LINE IN THE PIERCED REGION BEYOND THE ELASTIC LIMIT OF SAID MATERIAL THEREBY DEFORMING SAID LINE TO FORM A RETAINING WALL IN SAID OPENING WHICH WILL TEND TO RETAIN ITS SHAPE UPON REMOVAL OF THE INSTRUMENT; AND DEPOSITING ADDITIONAL CONDUCTIVE MATTER INTO SAID OPENING TO PROVIDE A PERMANENT ELECTRICAL CONNECTION BETWEEN SAID PAIR OF LINES; WHEREIN SAID STEP OF DEPOSITING IS ACCOMPLISHED BY AN ELECTROPLATING PROCESS IN WHICH THE SAID OTHER CONDUCTIVE LINE OF SAID PAIR IS CONNECTED TO ONE TERMINAL OF A SOURCE OF DIRECT CURRENT AND THE OPENING REGION RETAINED BY THE ONE LINE OF SAID PAIR IS CONTROLLABLY EXPOSED THROUGH AN ELECTROPLATING SOLUTION TO AN ELECTRODE OF AN ELECTROPLATING SYSTEM INCLUDING SAID SOURCE AND SAID OTHER LINE.