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US3624894A Expired / Lapsed US ⏱️ 0.0 years remaining

Sealing technique for transparent lids on integrated circuit packages

Assignee: Northrop Grumman Space and Mission Systems Corp
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Filing: 1969-10-29
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Granted: 1971-12-07
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Expires: 1989-10-29
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Abstract

Abstract Where thin film resistors in an integrated circuit require laser adjustment, an optically true transparent lid is hermetically sealed to the base flatpack. The lid is vapor plated with chromium in a predetermined pattern followed by a coating of gold. A hermetic seal which maintains its integrity under moderate thermal shock conditions is formed by soldering to the flatpack.

Inventors

  • 👤 Ralph W Miller

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-29 11:39
CPC Classifications
H; H10; H10W; H10W95/00

Claims Analysis

Total Claims: 0
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References Cited (Backward Citations)

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USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1974-12-06 1975-06-07 1975-12-07 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1978-12-06 1979-06-07 1979-12-07 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1982-12-06 1983-06-07 1983-12-07 $7700.00 Window Closed / Lapsed

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