US3624894A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Sealing technique for transparent lids on integrated circuit packages
Assignee: Northrop Grumman Space and Mission Systems Corp
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Filing: 1969-10-29
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Granted: 1971-12-07
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Expires: 1989-10-29
Abstract
Abstract Where thin film resistors in an integrated circuit require laser adjustment, an optically true transparent lid is hermetically sealed to the base flatpack. The lid is vapor plated with chromium in a predetermined pattern followed by a coating of gold. A hermetic seal which maintains its integrity under moderate thermal shock conditions is formed by soldering to the flatpack.
Inventors
- 👤 Ralph W Miller
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 05:20
CPC Classifications
H; H10; H10W; H10W95/00
Claims Analysis
Total Claims: 0
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References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1974-12-06 | 1975-06-07 | 1975-12-07 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1978-12-06 | 1979-06-07 | 1979-12-07 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1982-12-06 | 1983-06-07 | 1983-12-07 | $7700.00 | Window Closed / Lapsed |