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US3617682A
Expired / Lapsed
US
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Semiconductor chip bonder
Assignee: General Electric Co
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Filing: 1969-06-23
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Granted: 1971-11-02
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Expires: 1989-06-23
Abstract
Abstract An apparatus for attaching semiconductor chips to gold pads is described as comprising a stainless steel hot stage mounted on top of a heater block having a temperature of approximately 300* C. with a platinum ribbon heater or an RF heater element protruding through a hole in the hot stage and flush with the top surface thereof so as to provide a local hot spot smaller than the gold pads to which the semiconductor chips are to be attached. A current passed through the platinum causes heating to a temperature sufficient to eutectically bond the chip to the gold pad. An inert atmosphere is provided during the bonding operation to enhance the accuracy and reproducibility of the bond.
Inventors
- 👤 Robert N Hall
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-26 22:18
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/04; H10P72/0444; B; B23; B23K; B23K20/00; B23K20/10; H10W; H10W72/00
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
25 words
The combination of claim 1 further comprising: means providing a cover gas in the vicinity of said bond to improve the formation and wetting thereof.
Claim 2
Dependent Claim
27 words
The combination of claim 1 wherein said separate heating means providing heat comprises: a platinum ribbon filament in contacting relation with the opposite surface of said substrate.
Claim 3
Dependent Claim
23 words
The combination of claim 1 wherein said separate heating means providing heat comprises: an RF heater element in contacting relation with said substrate.
Claim 4
Dependent Claim
31 words
The combination of claim 1 wherein said means holding a semiconductor chip comprises: a collet having a heater element attached thereto to maintain said collet at a substantially constant predetermined temperature.
Claim 5
Dependent Claim
19 words
The combination of claim 1 further comprising: means for adjustably positioning said substrate with respect to the heating means.
Claim 6
Dependent Claim
24 words
The combination of claim 2 wherein said separate heating means providing heat comprises: a platinum ribbon heater filament in contacting relation with said substrate.
Claim 7
Dependent Claim
20 words
The combination of claim 7 wherein said cover gas is selected from the group consisting of nitrogen, argon and helium.
Claim 8
Dependent Claim
44 words
The combination of claim 8 further comprising: means including a pair of low thermal conductivity plates for adjustably positioning said substrate with respect to said filament and for controlling the flow of cover gas over the substrate, thereby excluding air from the bonding region.
Claim 9
Dependent Claim
30 words
The combination of claim 9 wherein said means holding a semiconductor chip comprises: a collet having a heater element attached thereto to maintain said collet at a substantially constant temperature.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1974-11-01 | 1975-05-03 | 1975-11-02 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1978-11-01 | 1979-05-03 | 1979-11-02 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1982-11-01 | 1983-05-03 | 1983-11-02 | $7700.00 | Window Closed / Lapsed |