Patent US3615737A successfully refreshed from Google Patents.
US3615737A
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Electroless copper deposition
Assignee: Kollmorgen Corp
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Filing: 1969-08-04
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Granted: 1971-10-26
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Expires: 1989-08-04
Abstract
Abstract An improved electroless metal deposition solution is provided which comprises, in combination: an ion of a metal whose electroless metal deposition is desired; a complexing agent for said ion; a reducing agent for said ion; a pH regulator; and a small effective amount of an extraneous ion which has a potential dependent capacity for inner double layer absorption at a surface in contact with the solution on which said metal is electrolessly depositing. In addition, improved methods for electrolessly depositing metal, as well as enhancing the ductility of electroless metal deposits are provided.
Inventors
- 👤 Frederick W Schneble Jr
- 👤 John F Mccormack
- 👤 Rudolph J Zeblisky
- 👤 John D Williamson
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 18:47
CPC Classifications
C; C23; C23C; C23C18/00; C23C18/16; C23C18/31; C23C18/38; C23C18/40
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
37 words
In a solution of claim 1, in which said extraneous ion is adsorbable at the inner layer of an electric double layer present at a surface in contact with the solution of said copper is electrolessly depositing.
Claim 2
Dependent Claim
38 words
In the solution of claim 1, in which said extraneous ion is chemisorbable at the inner layer of an electric double layer present at a surface in contact with the solution on which said copper is electrolessly depositing.
Claim 3
Dependent Claim
15 words
An electroless copper deposition solution of claim 1 which includes a water soluble cyanide compound.
Claim 4
Dependent Claim
13 words
An electroless copper deposition of claim 1 which includes a sulfur containing compound.
Claim 5
Dependent Claim
17 words
An electroless copper deposition solution of claim 1 which includes a cyanide compound and a sulfur compound.
Claim 6
Dependent Claim
33 words
The solution of claim 1 which includes less than 25 parts per miLlion of an ion having an oxidation potential greater than the oxidation potential of the ion whose electroless deposition is desired.
Claim 7
Dependent Claim
19 words
The solution of claim 7 wherein said less than 25 parts per million of an ion is iron ions.
Claim 8
Dependent Claim
22 words
The solution of claim 1 wherein the amount of said extraneous ion is between about 0.1 and 10,000 microgram mole per liter.
Claim 9
Dependent Claim
119 words
In a method for electrolessly depositing metal which comprises contacting a surface sensitive to the reception of electroless copper with an electroless metal deposition solution containing an ion of copper, a complexing agent for said ion, a reducing agent for said ion and a pH regulator, the improvement which comprises maintaining in the solution an effective amount of an extraneous ion of an element selected from the group consisting of vanadium, arsenic, antimony, bismuth and mixtures thereof which extraneous ion has a potential dependent capacity for being preferentially adsorbed at the inner layer of the electric double layer present at the electroless metal deposition surface for screening said surface from the absorption of hydrogen released by said reducing agent.
Claim 10
Dependent Claim
103 words
In a method for depositing copper on designated areas of an insulating member to form printed circuits, the surface of said designated areas being sensitive to the reception of electroless copper by contacting the insulating member with an electroless copper deposition solution; the improvement for enhancing the ductility of the electroless copper deposited on said designated, sensitized areas which comprises maintaining in the solution an extraneous ion having a potential dependent capacity for being adsorbed on said designated areas in preference to hydrogen, said extraneous ion being of an element selected from the group consisting of vanadium, arsenic, antimony, bismuth and mixtures thereof.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1974-10-25 | 1975-04-26 | 1975-10-26 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1978-10-25 | 1979-04-26 | 1979-10-26 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1982-10-25 | 1983-04-26 | 1983-10-26 | $7700.00 | Window Closed / Lapsed |