Patent US3609283A successfully refreshed from Google Patents.
US3609283A
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Method and apparatus for soldering insulated wire
Assignee: Argus International
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Filing: 1969-10-29
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Granted: 1971-09-28
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Expires: 1989-10-29
Abstract
Abstract A method and apparatus for stripping and soldering very fine insulated wire. A number of such wires may be stripped and soldered simultaneously whereby the insulated wires are each positioned above an associated terminal pad, a radiation transparent rod is firmly urged against all of the wires and is vibrated preferably in a reciprocating fashion, in a direction parallel to the length of the wires, substantially simultaneously with the application of radiation from a heat source which simultaneously irradiates all of the wires and their associated pads through the radiation-transmissive element. The radiation focused upon the wires causes a solder predeposited upon the terminal pads to melt and wet the pads, and also heat the wire whereby the insulation is softened to the point where it is split by the reciprocating force and is floated away by the solder which runs through the ruptured insulation and up and around the bare wire to form an excellent solder joint between the wire and pad, and wherein the heat applied is sufficient to form a good solder joint and yet insufficient to damage any neighboring heatsensitive elements.
Inventors
- 👤 Bernard J Costello
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 02:18
CPC Classifications
B; B23; B23K; B23K1/00; B23K1/005; B23K1/0053; H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3494
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
189 words
A method for bonding wire having heat-strippable insulaTion to a conductive terminal comprising the steps of: a. coating the conductive terminal with a predetermined amount of solder; b. positioning a portion of said wire upon said terminal; c. firmly holding said wire and said terminal into intimate engagement with a rigid energy-transmissive member having at least a portion of its surface engaging the insulation surface of the wire; d. focusing radiation upon said energy-transmissive member to pass therethrough for irradiation of the wire and the terminal in the region of engagement, the energy level of said radiation being sufficient to soften said insulation and melt the solder and heat same to a temperature sufficient to form a good bond between said engaged wire and terminal; e. scrubbing said rigid member across said wire a predetermined number of times to cause the insulation which has been softened by the radiant energy, to break away from the wire in the region of engagement with the terminal thereby enabling the molten solder flow between the wire and the insulation and form a good solder joint between the stripped wire and the terminal.
Claim 2
Independent Claim
189 words
A method for bonding wire having heat-strippable insulaTion to a conductive terminal comprising the steps of: a. coating the conductive terminal with a predetermined amount of solder; b. positioning a portion of said wire upon said terminal; c. firmly holding said wire and said terminal into intimate engagement with a rigid energy-transmissive member having at least a portion of its surface engaging the insulation surface of the wire; d. focusing radiation upon said energy-transmissive member to pass therethrough for irradiation of the wire and the terminal in the region of engagement, the energy level of said radiation being sufficient to soften said insulation and melt the solder and heat same to a temperature sufficient to form a good bond between said engaged wire and terminal; e. scrubbing said rigid member across said wire a predetermined number of times to cause the insulation which has been softened by the radiant energy, to break away from the wire in the region of engagement with the terminal thereby enabling the molten solder flow between the wire and the insulation and form a good solder joint between the stripped wire and the terminal.
Claim 3
Dependent Claim
29 words
The method of claim 1 wherein step (d) further comprises the step of limiting the upper energy level of said radiation to prevent said insulation from burning or evaporating.
Claim 4
Dependent Claim
27 words
The method of claim 1 wherein step (a) further comprises the step of coating the engaged surfaces of the wire and the terminal with a solder flux.
Claim 5
Independent Claim
149 words
A method for stripping heat-strippable insulation from wire comprising the steps of: a. positioning the wire upon a rigid surface coated with solder; b. firmly urging said wire into intimate engagement with the rigid surface with a rigid radiation-transmissive member having at least a portion of its surface engaging the insulation surface of the wire; c. focusing radiation upon said energy-transmissive member to pass therethrough for irradiation of the wire in the region of engagement, the energy level of said radiation being sufficient to soften said insulation; d. scrubbing said rigid member across said wire a predetermined number of times to cause the insulation which has been softened by the radiant energy, to break away from the wire in the region of the terminal thereby enabling the molten solder flow between the wire and the insulation and form a good solder joint between the stripped wire and the terminal.
Claim 6
Independent Claim
149 words
A method for stripping heat-strippable insulation from wire comprising the steps of: a. positioning the wire upon a rigid surface coated with solder; b. firmly urging said wire into intimate engagement with the rigid surface with a rigid radiation-transmissive member having at least a portion of its surface engaging the insulation surface of the wire; c. focusing radiation upon said energy-transmissive member to pass therethrough for irradiation of the wire in the region of engagement, the energy level of said radiation being sufficient to soften said insulation; d. scrubbing said rigid member across said wire a predetermined number of times to cause the insulation which has been softened by the radiant energy, to break away from the wire in the region of the terminal thereby enabling the molten solder flow between the wire and the insulation and form a good solder joint between the stripped wire and the terminal.
Claim 7
Dependent Claim
176 words
Means for bonding, by infrared radiation, selected regions of first and second members arranged in a predetermined manner with the surfaces of said selected regions thereof being in surface contact, and wherein one of said members is a wire having heat-strippable insulation and the other member is coated with solder; holding means for maintaining said predetermined arrangement and for urging said selected regions into intimate contact; said holding means being positioned above said prearranged selected regions; infrared radiation means including a radiation source and means for focusing rays emanating from said source into a zone substantially encompassing said aligned selected regions, for heating the members and melting the solder; said holding means being a rigid light-transmissive member passing said rays therethrough to said focal zone with relatively insignificant attenuation; means for moving said light-transmissive member in a reciprocating fashion causing said light-transmissive member to scrub across the wire as it is being heated to thereby split the insulation and enable the molten solder to wet the stripped wire and bond it to the said other member.
Claim 8
Dependent Claim
176 words
Means for bonding, by infrared radiation, selected regions of first and second members arranged in a predetermined manner with the surfaces of said selected regions thereof being in surface contact, and wherein one of said members is a wire having heat-strippable insulation and the other member is coated with solder; holding means for maintaining said predetermined arrangement and for urging said selected regions into intimate contact; said holding means being positioned above said prearranged selected regions; infrared radiation means including a radiation source and means for focusing rays emanating from said source into a zone substantially encompassing said aligned selected regions, for heating the members and melting the solder; said holding means being a rigid light-transmissive member passing said rays therethrough to said focal zone with relatively insignificant attenuation; means for moving said light-transmissive member in a reciprocating fashion causing said light-transmissive member to scrub across the wire as it is being heated to thereby split the insulation and enable the molten solder to wet the stripped wire and bond it to the said other member.
Claim 9
Dependent Claim
25 words
The bonding device of claim 5 wherein said rigid light-transmissive member is formed of a material taken from the group consisting of quartz, sapphire, pyrex.
Claim 10
Dependent Claim
33 words
The means of claim 5 wherein said rigid light-transmissive member being an elongated rod having a substantially circular shaped cross section for concentrating the rays passing therethrough upon the selected areas being irradiated.
Claim 11
Dependent Claim
256 words
Means for Bonding, by infrared radiation, selected regions of first and second members arranged in a predetermined manner with the surfaces of said selected regions thereof being in surface contact, and wherein one of said members is a wire having heat-strippable insulation and the other member is coated with solder; holding means for maintaining said predetermined arrangement and for urging said selected regions into intimate contact; said holding means being positioned above said aligned selected regions; infrared radiation means including a radiation source and means for focusing rays emanating from said source into a zone substantially encompassing said aligned selected regions; said holding means being a rigid light-transmissive member passing said rays therethrough to said focal zone with relatively insignificant attenuation; one of said members being joined being a printed circuit board having a first plurality of conductive leads comprising said printed circuit pattern arranged in said selected region; the other of said members comprising means having a second plurality of insulation coated heat-strippable conductive leads extending therefrom and each being aligned for surface contact with an associated one of said first plurality of conductive leads; said holding means engaging and urging said second plurality of conductive leads into intimate surface contact with said first plurality of conductive leads; means for moving said light-transmissive member in a reciprocating fashion causing said light-transmissive member to scrub across the wire as it is being heated to thereby split the insulation and enable the molten solder to wet the stripped wire and bond it to the said other member.
Claim 12
Dependent Claim
256 words
Means for Bonding, by infrared radiation, selected regions of first and second members arranged in a predetermined manner with the surfaces of said selected regions thereof being in surface contact, and wherein one of said members is a wire having heat-strippable insulation and the other member is coated with solder; holding means for maintaining said predetermined arrangement and for urging said selected regions into intimate contact; said holding means being positioned above said aligned selected regions; infrared radiation means including a radiation source and means for focusing rays emanating from said source into a zone substantially encompassing said aligned selected regions; said holding means being a rigid light-transmissive member passing said rays therethrough to said focal zone with relatively insignificant attenuation; one of said members being joined being a printed circuit board having a first plurality of conductive leads comprising said printed circuit pattern arranged in said selected region; the other of said members comprising means having a second plurality of insulation coated heat-strippable conductive leads extending therefrom and each being aligned for surface contact with an associated one of said first plurality of conductive leads; said holding means engaging and urging said second plurality of conductive leads into intimate surface contact with said first plurality of conductive leads; means for moving said light-transmissive member in a reciprocating fashion causing said light-transmissive member to scrub across the wire as it is being heated to thereby split the insulation and enable the molten solder to wet the stripped wire and bond it to the said other member.
Claim 13
Dependent Claim
45 words
The bonding device of claim 7 wherein a layer of conformal material is positioned between the printed circuit board and a supporting surface to enable said board to flex and thereby distribute the force of the holding means upon the wires to be evenly distributed.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1974-09-27 | 1975-03-29 | 1975-09-28 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1978-09-27 | 1979-03-29 | 1979-09-28 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1982-09-27 | 1983-03-29 | 1983-09-28 | $7700.00 | Window Closed / Lapsed |