Patent US3608029A successfully refreshed from Google Patents.
US3608029A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Process for encapsulating electronic components
Assignee: Vitramon Inc
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Filing: 1969-03-12
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Granted: 1971-09-21
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Expires: 1989-03-12
Abstract
Abstract The present invention relates to a process for encapsulating electronic components in protective casings. More particularly, the component is placed in the case and the space between the walls of the case and the component filled with mineral beads having a thermal coefficient of expansion approximating that of the component. Holes are then drilled in two sides of the case and the case is placed in a container of liquid epoxy. Capillary attraction forces the epoxy in through one set of holes in the case, driving air out through the other set. After the case is filled with epoxy and devoid of air, it can be baked to harden the epoxy.
Inventors
- 👤 Arthur Joseph Hough
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-25 11:05
CPC Classifications
H; H05; H05K; H05K5/00; H05K5/06; H05K5/064; H10; H10W; H10W76/00; H10W76/40; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49146
Claims Analysis
Total Claims: 1
Claim 1
Independent Claim
25 words
The process as in claim 1 wherein there is at least one set of holes in a wall of the case opposite the first wall.
References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1974-09-20 | 1975-03-22 | 1975-09-21 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1978-09-20 | 1979-03-22 | 1979-09-21 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1982-09-20 | 1983-03-22 | 1983-09-21 | $7700.00 | Window Closed / Lapsed |