Method for interconnecting solid state devices such as integrated circuit chips
Abstract
Abstract A METHOD FOR INTERCONNECTING DEVICE CHIPS SUCH AS INTEGRATED CIRCUIT CHIPS ON A SUBSTRATE IS DISCLOSED. A PHOTOGRAPHIC MASK IS MADE FROM A TRANSPARENT SHEET WHICH IS PLACED ON A DIAGRAM OF A CIRCUIT CONTAINING THE CHIPS. TEMPLATES REPRESENTATIVE OF THE DEVICE CHIPS AND STRIPS REPRESENTATIVE OF THE INTERCONNECTING LEADS ARE IMPOSED ON THE TRANSPARENT SHEET. SEPARATE MASKS FOR THE CROSSOVER LEADS AND FOR FORMING HOLES IN A DIELECTRIC TO ALLOW THE CONNECTIONS BETWEEN THE CROSSOVER LEADS AND THE REMAINDER OF THE CIRCUIT ARE FORMED FROM SECOND AND THIRD TRANSPARENT SHEETS. THE MASKS MADE FROM THESE TRANSPARENT SHEETS ARE UTILITZED TO FORM THE INTERCONNECTIONS IN THE CIRCUIT BY PHOTOFABRICATION TECHNIQUES.
Inventors
- 👤 Jon M Schroeder
Bibliographic Details
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