Patent US2906320A successfully refreshed from Google Patents.
Patent US3604609A successfully refreshed from Google Patents.
US3604609A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Apparatus for eliminating iciclelike formations on wave-soldered connections on circuit substrates
Assignee: AT&T Inc
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Filing: 1968-12-02
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Granted: 1971-09-14
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Expires: 1988-12-02
Abstract
Abstract Iciclelike formations of solder which occur when a circuit substrate and associated conductive leads pass over a wavesoldering machine are reduced in size by passing the substrate over a fine stretched wire so positioned that a small space exists between the surface of the wire and the highest projection on the circuit substrate, breaking the surface tension of the formations.
Inventors
- 👤 Edgar H Walls
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 21:00
CPC Classifications
H; H01; H01G; H01G4/00; H01G4/002; H01G4/228; B; B23; B23K; B23K3/00; B23K3/06; B23K3/0646; B23K3/0653; B23K2101/00; B23K2101/36; B23K2101/42
Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
144 words
Apparatus for soldering conductive leads to a circuit that is affixed to a surface of a substrate to provide electrical junctions, wherein the terminal portions of said leads extend beyond said surface by distances not exceeding a predetermined distance, comprising: a device for applying a wave of molten solder to said surface; means for moving the substrate past said wave-soldering device whereby iciclelike formations of solder tend to form at the junctions of said leads with said circuit; and a fine wire for reducing the size of the iciclelike formations, the wire oriented a fixed distance from the crest of the wave of molten solder to warm the wire above room temperature and another fixed distance in excess of said predetermined distance from said surface so that said wire engages with and breaks the surface tension of said solder formations without contacting said leads.
Claim 2
Dependent Claim
144 words
Apparatus for soldering conductive leads to a circuit that is affixed to a surface of a substrate to provide electrical junctions, wherein the terminal portions of said leads extend beyond said surface by distances not exceeding a predetermined distance, comprising: a device for applying a wave of molten solder to said surface; means for moving the substrate past said wave-soldering device whereby iciclelike formations of solder tend to form at the junctions of said leads with said circuit; and a fine wire for reducing the size of the iciclelike formations, the wire oriented a fixed distance from the crest of the wave of molten solder to warm the wire above room temperature and another fixed distance in excess of said predetermined distance from said surface so that said wire engages with and breaks the surface tension of said solder formations without contacting said leads.
Claim 3
Dependent Claim
33 words
In apparatus, as recited in claim 1, the improvement wherein said wire is oriented parallel to the principal axis of said wave-soldering device and transverse to the direction of movement of said substrate.
Claim 4
Dependent Claim
25 words
Apparatus in accordance with claim 2, including said wave-soldering device and said moving means in combination with said wire, in cooperating relationship as set forth.
Claim 5
Dependent Claim
165 words
A wave-soldering apparatus wherein the size of iciclelike formations of solder on the lower surface of an electrical circuit board are reduced, comprising: a wave-soldering device for producing a wave of molten solder, the wave having a predetermined crest; a taut fine wire positioned below and spaced from but close to the crest of the wave of molten solder, said solder warming the wire above room temperature; and means for moving the circuit board past the soldering device to engage the lower surface of the board with said crest and for moving said surface past the wire, the wire being positioned so that there is a small space between the surface of the wire and the greatest projection on the lower surface of the circuit board when said board is passed by the wire, the formations of solder being in the molten state and engaging with the wire when the circuit board passes by the wire, whereby the formations of solder are limited in size.
Claim 6
Dependent Claim
165 words
A wave-soldering apparatus wherein the size of iciclelike formations of solder on the lower surface of an electrical circuit board are reduced, comprising: a wave-soldering device for producing a wave of molten solder, the wave having a predetermined crest; a taut fine wire positioned below and spaced from but close to the crest of the wave of molten solder, said solder warming the wire above room temperature; and means for moving the circuit board past the soldering device to engage the lower surface of the board with said crest and for moving said surface past the wire, the wire being positioned so that there is a small space between the surface of the wire and the greatest projection on the lower surface of the circuit board when said board is passed by the wire, the formations of solder being in the molten state and engaging with the wire when the circuit board passes by the wire, whereby the formations of solder are limited in size.
Claim 7
Dependent Claim
15 words
The apparatus in accordance with claim 4, wherein said space measures 0.003 to 0.005 inch.
Claim 8
Dependent Claim
17 words
The apparatus in accordance with claim 4, wherein said fine wire has a diameter approximately 0.020 inch.
Claim 9
Dependent Claim
196 words
In combination, a wave-soldering device for producing a molten wave of solder along a horizontal path, the crest of said wave being produced at a distance a with respect to a reference plane; a substrate having a circuit affixed to one surface thereof and a plurality of leads coupled to said circuit, the terminal portions of said leads extending beyond said surface by distances not exceeding a fixed distance b from said surface; a horizontal fine wire, parallel to said path, located at one side of, and proximate to, the crest of the wave of molten solder to warm the wire above room temperature, said wire being oriented at a distance c with respect to said reference plane; and means for transporting said substrate from the other side of the wave-soldering device, past the molten wave, and hence over the horizontal wire, said substrate being transported with said one surface oriented downward at a distance d with respect to the reference plane, whereby iciclelike formations of solder formed at the junctions of said leads with said circuit are reduced in size due to the breaking of its surface tension by said wire; wherein a>d and (b+c)<d.
Claim 10
Dependent Claim
196 words
In combination, a wave-soldering device for producing a molten wave of solder along a horizontal path, the crest of said wave being produced at a distance a with respect to a reference plane; a substrate having a circuit affixed to one surface thereof and a plurality of leads coupled to said circuit, the terminal portions of said leads extending beyond said surface by distances not exceeding a fixed distance b from said surface; a horizontal fine wire, parallel to said path, located at one side of, and proximate to, the crest of the wave of molten solder to warm the wire above room temperature, said wire being oriented at a distance c with respect to said reference plane; and means for transporting said substrate from the other side of the wave-soldering device, past the molten wave, and hence over the horizontal wire, said substrate being transported with said one surface oriented downward at a distance d with respect to the reference plane, whereby iciclelike formations of solder formed at the junctions of said leads with said circuit are reduced in size due to the breaking of its surface tension by said wire; wherein a>d and (b+c)<d.
Claim 11
Dependent Claim
14 words
The combination according to claim 7, wherein d-b-c is from 3 to 5 mils.
Claim 12
Independent Claim
219 words
An apparatus for wave soldering the lower surface of an electrical circuit board and for reducing the size of iciclelike formations of solder on such lower surface, comprising: a wave-soldering device for producing a wave of molten solder, the wave having a predetermined crest; a taut fine wire positioned below and spaced from the crest of the wave of molten solder, whereby heat from the solder aids in warming the wire; means for first moving the lower surface of the circuit board past the soldering device to engage such surface with said crest to thereby apply molten solder to said surface and produce iciclelike formations depending from said surface, and then for moving said surface past the wire; and a baffle spaced beneath the wire and over which the molten solder flows for reflecting heat from the molten solder to aid in warming the wire above room temperature and to maintain the solder applied to the board in its molten form, the warm wire being positioned so that there is a small space between the surface of the wire and the lower surface of the circuit board when said board is passed by the wire, the molten iciclelike formations of solder engaging the warm wire when said surface passes by the wire, whereby said formations are limited in size.
Claim 13
Independent Claim
219 words
An apparatus for wave soldering the lower surface of an electrical circuit board and for reducing the size of iciclelike formations of solder on such lower surface, comprising: a wave-soldering device for producing a wave of molten solder, the wave having a predetermined crest; a taut fine wire positioned below and spaced from the crest of the wave of molten solder, whereby heat from the solder aids in warming the wire; means for first moving the lower surface of the circuit board past the soldering device to engage such surface with said crest to thereby apply molten solder to said surface and produce iciclelike formations depending from said surface, and then for moving said surface past the wire; and a baffle spaced beneath the wire and over which the molten solder flows for reflecting heat from the molten solder to aid in warming the wire above room temperature and to maintain the solder applied to the board in its molten form, the warm wire being positioned so that there is a small space between the surface of the wire and the lower surface of the circuit board when said board is passed by the wire, the molten iciclelike formations of solder engaging the warm wire when said surface passes by the wire, whereby said formations are limited in size.
Claim 14
Dependent Claim
110 words
A wave-soldering apparatus comprising: a wave-soldering device for producing a wave of molten solder; a taut fine wire oriented a fixed distance from the crest of the wave of molten solder to warm the wire above room temperature; and means for first moving the circuit board past the soldering device to apply the wave of solder to the lower surface of the board and to produce iciclelike formations of solder depending from the surface, and for then moving said board past and a predetermined distance from the wire, the wire being positioned so that it engages any iciclelike formations of solder depending from the surface to thereby limit their formations.
Claim 15
Dependent Claim
110 words
A wave-soldering apparatus comprising: a wave-soldering device for producing a wave of molten solder; a taut fine wire oriented a fixed distance from the crest of the wave of molten solder to warm the wire above room temperature; and means for first moving the circuit board past the soldering device to apply the wave of solder to the lower surface of the board and to produce iciclelike formations of solder depending from the surface, and for then moving said board past and a predetermined distance from the wire, the wire being positioned so that it engages any iciclelike formations of solder depending from the surface to thereby limit their formations.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1974-09-13 | 1975-03-15 | 1975-09-14 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1978-09-13 | 1979-03-15 | 1979-09-14 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1982-09-13 | 1983-03-15 | 1983-09-14 | $7700.00 | Window Closed / Lapsed |