Patent US3602634A successfully refreshed from Google Patents.
US3602634A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Hermetic seal
Assignee: Fairchild Semiconductor Corp
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Filing: 1970-03-23
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Granted: 1971-08-31
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Expires: 1990-03-23
Abstract
Abstract A semiconductor package contains a cover with a flange around that portion of the edge in contact with the bottom of the package. The flange makes an acute angle with the package bottom. Bonding material placed between the flange and the package bottom, when melted, is drawn by capillary action along facing surfaces of the flange and package bottom thereby to form a solid bond between the cover and the bottom.
Inventors
- 👤 William P Meuli
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-07 18:55
CPC Classifications
H; H10; H10W; H10W76/00; H10W76/60; H10W95/00
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
75 words
A semiconductor package comprising a substrate containing on one surface thereof at least one semiconductor device surrounded by a rim of at least one contact metal, a cover with an edge contacting said rim, a flange being attached to said edge, said flange at least partly overlying and making an acute angle with the surface of said rim, and bonding material between said flange and the underlying rim joining said cover to said underlying substrate.
Claim 2
Dependent Claim
75 words
A semiconductor package comprising a substrate containing on one surface thereof at least one semiconductor device surrounded by a rim of at least one contact metal, a cover with an edge contacting said rim, a flange being attached to said edge, said flange at least partly overlying and making an acute angle with the surface of said rim, and bonding material between said flange and the underlying rim joining said cover to said underlying substrate.
Claim 3
Dependent Claim
18 words
The package in claim 1 wherein said flange rises up and outward from the edge of said cover.
Claim 4
Dependent Claim
18 words
Structure as in claim 1 wherein said flange rises up and inward from the edge of said cover.
Claim 5
Dependent Claim
147 words
Structure as in claim 1 wherein said substrate comprises an aluminum oxide ceramic containing thereon a first layer of metallization overlaid by a glass layer on which is formed a second layer of metallization in electrical connection to said at least one semiconductor device, said second layer of metallization selectively contacting through windows in said glass layer said first layer of metallization, said first layer of metallization extending beneath said rim to thereby provide external contact to said at least one semiconductor device within said package, and said rim of at least one contact metal comprising an electrically isolated annular portion of said second layer of metallization on which are formed a plurality of layers of metal, said plurality of layers of metal including a barrier layer of metal formed directly on said rim, and a wettable layer of metal formed on said barrier layer of metal.
Claim 6
Dependent Claim
28 words
Structure as in claim 4 wherein said second layer of metallization comprises aluminum, said barrier layer of metal comprises nickel, and said wettable layer of metal comprises copper.
Claim 7
Dependent Claim
18 words
Structure as in claim 5 wherein a thin layer of gold is plAced on said layer of copper.
Claim 8
Dependent Claim
13 words
Structure as in claim 6 wherein said bonding material comprises a gold-tin mixture.
Claim 9
Dependent Claim
22 words
Structure as in claim 7 wherein said cover is made of a material consisting of a combination of nickel, iron and cobalt;
Claim 10
Dependent Claim
31 words
Structure as in claim 8 wherein said glass comprises a mixture of65 percent lead oxide, about 10 percent alumina, 10 percent silicon dioxide, 3 percent titanium oxide and the remainder boron.
References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1974-08-30 | 1975-03-01 | 1975-08-31 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1978-08-30 | 1979-03-01 | 1979-08-31 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1982-08-30 | 1983-03-01 | 1983-08-31 | $7700.00 | Window Closed / Lapsed |