Method of making laminated semiconductor devices
Abstract
Abstract IN THE FABRICATION OF SEMICONDUCTOR DEVICES, A SURFACE OF A SEMICONDUCTOR WAFER, CONTAINING A PLURALITY OF INDIVIDUAL SEMICONDUCTOR COMPONENTS, IS PROVIDED WITH A PASTE-LIKE, VISCOUS LAYER OF A BONDING CEMENT, SUCH AS AN EPOXY RESIN. THE PASTE-LIKE MATERIAL IS RENDERED RELATIVELY HARD AND NON-VISCOUS, FOR THE PURPOSE OF FACILITATING FURTHER HANDLING OF THE WAFER, AND THE WAFER, AFTER SUCH FURTHER HANDLING, IS CRACKED TO PROVIDE INDIVIDUAL PELLETS, EACH HAVING A SURFACE OF NON-VISCOUS BONDING CEMENT. THE BONDING CEMENT IS THEN RESOFTENED TO A PASTE-LIKE, ADHESIVE STATE, AND THE BONDING CEMENT LAYER IS ENGAGED WITH A SUPPORT MEMBER TO WHICH THE PELLET IS TO BE BONDED. THE ASSEMBLY IS HEATED TO CURE THE BONDING CEMENT TO FORM A RIGID BOND BETWEEN THE PELLET AND THE SUPPORT MEMBER.
Inventors
- 👤 Joseph Breen
Bibliographic Details
Claims Analysis
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| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
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| 3.5 Years (Year 4) | 1974-08-16 | 1975-02-15 | 1975-08-17 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1978-08-16 | 1979-02-15 | 1979-08-17 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1982-08-16 | 1983-02-15 | 1983-08-17 | $7700.00 | Window Closed / Lapsed |