US3593186A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Thermal dissipation in semiconductor device arrays
Assignee: Raytheon Co
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Filing: 1969-02-18
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Granted: 1971-07-13
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Expires: 1989-02-18
Abstract
Abstract Semiconductor devices individually as well as in stacked arrays for operation at increased electrical power levels are supported by heat sink structures of a conductive material within a transmission line section to generate oscillations at microwave frequencies. Dissipation of the thermal energy generated, particularly in such devices operated at high power densities and exhibiting negative resistance characteristics in enhanced by the increased radiation surfaces coupled to the semiconductor. The semiconductor devices are electrically insulated DC-wise when mounted within the transmission line which also serves as the circuit for the generation of the AC field.
Inventors
- 👤 Edward C Dench
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 07:45
CPC Classifications
H; H03; H03B; H03B9/00; H03B9/12; H03B9/14; H03B9/143
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
63 words
Microwave energy transmission apparatus comprising: a section of transmission line for propagating electromagnetic energy; and semiconductor means disposed along said propagation path by support means joined to the walls of said transmission line section and extending in a direction perpendicular to the electric field of said energy; said support means including thermally conductive members with electrical insulating members appended to the ends thereof.
Claim 2
Dependent Claim
63 words
Microwave energy transmission apparatus comprising: a section of transmission line for propagating electromagnetic energy; and semiconductor means disposed along said propagation path by support means joined to the walls of said transmission line section and extending in a direction perpendicular to the electric field of said energy; said support means including thermally conductive members with electrical insulating members appended to the ends thereof.
Claim 3
Dependent Claim
110 words
Microwave energy transmission apparatus comprising: a section of transmission line defining a propagation path for electromagnetic energy; plural semiconductor means in stacked arrays disposed along said propagation path by support means joined to the walls of said transmission line section and extending in a direction perpendicular to the electric field of said energy; said semiconductor means being electrically connected in series; said support means including parallel disposed thermally conductive members for dissipation of heat generated by said semiconductor means; and members of an insulating material having a high thermal conductivity appended to the ends of said thermally conductive members adjacent to the point of joining to said transmission line section.
Claim 4
Dependent Claim
110 words
Microwave energy transmission apparatus comprising: a section of transmission line defining a propagation path for electromagnetic energy; plural semiconductor means in stacked arrays disposed along said propagation path by support means joined to the walls of said transmission line section and extending in a direction perpendicular to the electric field of said energy; said semiconductor means being electrically connected in series; said support means including parallel disposed thermally conductive members for dissipation of heat generated by said semiconductor means; and members of an insulating material having a high thermal conductivity appended to the ends of said thermally conductive members adjacent to the point of joining to said transmission line section.
Claim 5
Dependent Claim
91 words
Microwave energy transmission apparatus comprising broad and narrow wall structure defining a transmission line providing a propagation path for electromagnetic energy; plural semiconductor means disposed along said propagation path; and thermal dissipation means connected to each semiconductor means; said dissipation means including a thermally conductive member of a metallic material with members of an electrical insulating material appended to the ends; all of said thermal dissipation means providing for the removal of heat substantially in parallel to the broad walls with the insulating members joined to the narrow transmission line walls.
Claim 6
Dependent Claim
91 words
Microwave energy transmission apparatus comprising broad and narrow wall structure defining a transmission line providing a propagation path for electromagnetic energy; plural semiconductor means disposed along said propagation path; and thermal dissipation means connected to each semiconductor means; said dissipation means including a thermally conductive member of a metallic material with members of an electrical insulating material appended to the ends; all of said thermal dissipation means providing for the removal of heat substantially in parallel to the broad walls with the insulating members joined to the narrow transmission line walls.
Claim 7
Dependent Claim
121 words
Microwave energy transmission apparatus comprising: a section of transmission line having broad and narrow walls defining a propagation path for electromagnetic energy; plural stacked arrays of semiconductor means each arranged in series electrically disposed along said propagation path; said semiconductor means each having a body of a conductive heat sink material supporting the semiconductor material; thermal dissipation means connected to said heat sink bodies and said transmission line in a direction substantially parallel to said broad walls; said dissipation means including thermally conductive members with members of an electrical insulating material appended to the ends thereof; and means for electrically biasing said semiconductor means at a predetermined voltage potential in a direction substantially parallel to the electric field of said energy.
Claim 8
Dependent Claim
121 words
Microwave energy transmission apparatus comprising: a section of transmission line having broad and narrow walls defining a propagation path for electromagnetic energy; plural stacked arrays of semiconductor means each arranged in series electrically disposed along said propagation path; said semiconductor means each having a body of a conductive heat sink material supporting the semiconductor material; thermal dissipation means connected to said heat sink bodies and said transmission line in a direction substantially parallel to said broad walls; said dissipation means including thermally conductive members with members of an electrical insulating material appended to the ends thereof; and means for electrically biasing said semiconductor means at a predetermined voltage potential in a direction substantially parallel to the electric field of said energy.
Claim 9
Dependent Claim
72 words
Microwave energy transmission apparatus comprising: a section of transmission line defining a propagation path for electromagnetic energy; and plural semiconductor means of the negative resistance type disposed at intervals of one-half a guided wavElength by support means extending substantially perpendicular to the electric field of said energy and joined to the walls of said transmission line section; said support members including metallic members with electrical insulating members appended to the ends thereof.
Claim 10
Dependent Claim
72 words
Microwave energy transmission apparatus comprising: a section of transmission line defining a propagation path for electromagnetic energy; and plural semiconductor means of the negative resistance type disposed at intervals of one-half a guided wavElength by support means extending substantially perpendicular to the electric field of said energy and joined to the walls of said transmission line section; said support members including metallic members with electrical insulating members appended to the ends thereof.
Claim 11
Independent Claim
70 words
A method of cooling semiconductor devices disposed within a transmission line section having a broad and narrow dimension comprising the steps of: supporting all of said devices by thermally conductive support members arranged in a direction substantially parallel to the broad dimension of said transmission line; and joining the ends of said thermally conductive members with an electrically insulating material to the narrow dimension members of said transmission line section.
Claim 12
Independent Claim
70 words
A method of cooling semiconductor devices disposed within a transmission line section having a broad and narrow dimension comprising the steps of: supporting all of said devices by thermally conductive support members arranged in a direction substantially parallel to the broad dimension of said transmission line; and joining the ends of said thermally conductive members with an electrically insulating material to the narrow dimension members of said transmission line section.
References Cited (Backward Citations)
US3343107A
Cited
US3308352A
Cited
US3328730A
Cited
US3346825A
Cited
US3465265A
Cited
US3469171A
Cited
US3336535A
Cited
US3460055A
Cited
US3487334A
Cited
US3516018A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1974-07-12 | 1975-01-11 | 1975-07-13 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1978-07-12 | 1979-01-11 | 1979-07-13 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1982-07-12 | 1983-01-11 | 1983-07-13 | $7700.00 | Window Closed / Lapsed |