Transmission line mounting structure for semiconductor device

Claim 1

DIODE MOUNT STRUCTURE, COMPRISING: A GATING DIODE HAVING AN INPUT TERMINAL AND AN OUTPUT TERMINAL; A GROUND RING OF METAL SUPPORTED AROUND SAID DIODE POSITIONED APPROXIMATELY MIDWAY BETWEEN SAID INPUT AND OUTPUT TERMINALS; A PAIR OF SPACER SLEEVES OF CERAMIC MATERIAL EACH HAVING ONE END SECURED TO SAID GROUND RING ON THE OPPOSITE SIDES OF SAID GROUND RING; AN INPUT TERMINAL MEMBER OF METAL CONNECTED TO SAID INPUT TERMINAL OF SAID DIODE AND ATTACHED OVER THE OTHER END OF ONE OF SAID SPACER SLEEVES TO INSULATE SAID INPUT TERMINAL MEMBER FROM SAID GROUND RING; AN ANNULAR RESISTOR SUPPORTED ABOUT SAID ONE SPACER SLEEVE AND CONNECTED BETWEEN SAID INPUT TERMINAL MEMBER AND SAID GROUND RING, SUCH RESISTOR HAVING A RESISTANCE MUCH GREATER THAN THE FORWARD CONDUCTOR RESISTANCE OF SAID DIODE; AND AN OUTPUT TERMINAL MEMBER OF METAL CONNECTED TO SAID OUTPUT TERMINAL OF SAID DIODE AND SECURED OVER THE OTHER END OF THE OTHER OF SAID SPACER SLEEVES TO INSULATE SAID OUTPUT TERMINAL MEMBER FROM SAID GROUND RING AND TO FORM A HERMETICALLY SEALED CONTAINER FOR SAID DIODE WITH SAID SPACER SLEEVES, SAID GROUND RING AND SAID INPUT TERMINAL MEMBER, SAID RESISTOR BEING POSITIONED OUTSIDE OF THE DIODE CONTAINER.