Patent US3591839A successfully refreshed from Google Patents.
US3591839A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Micro-electronic circuit with novel hermetic sealing structure and method of manufacture
Assignee: Vishay Siliconix Inc
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Filing: 1969-08-27
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Granted: 1971-07-06
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Expires: 1989-08-27
Abstract
Abstract A semiconductor device wherein a semiconductor chip having an active element formed in a limited area is bonded to an insulating substrate with the chip spaced apart form the substrate and the active area hermetically sealed within the region defined by the insulating substrate, the body of the chip and the sealing ring. Conductive lands formed on the surface of the substrate pass beneath an insulating ring which is part of the sealing structure. Contact pads formed on the semiconductor chip electrically contact the conductive lands for providing electrical contact to the required areas of the active device.
Inventors
- 👤 Arthur D Evans
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-06 11:39
CPC Classifications
H; H10; H10W; H10W76/00; H10W76/60; H10D; H10D99/00; H10W72/00; H10W72/071; H10W72/072; H10W72/07231; H10W72/07236; H10W72/30; H10W72/331; H10W72/332; H10W72/851; H10W72/853; H10W72/856; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49144
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
52 words
A method as defined in claim 1 further including the step of providing bumps of bondable material on at least one of the pads formed on the semiconductor device and the lands formed on the substrate for bridging the space between the surface of the chip and the surface of the substrate.
Claim 2
Dependent Claim
229 words
An article of manufacture comprising: a. an insulating substrate; b. a plurality of lands of conductive material positioned on a surface of the substrate in spaced-apart relationship and having end portions positioned within a limited area and arranged in a predetermined configuration, each of said lands extending outwardly from said limited area; c. a ring of insulating material affixed to said surface and encircling said limited area with said lands passing from the limited area between the ring of insulating material and the substrate in sealing relationship; d. a ring of bondable material formed on the upper surface of said ring of said insulating material with said ring of insulating material separating said ring of bondable material from said lands; e. a chip of semiconductor material having at least one component defined in a surface positioned in opposed, spaced-apart relationship to the surface of the substrate; f. a ring of bondable material formed on the surface of the chip in opposed relationship to the ring of bondable material formed on the ring of insulating material and encircling said at least one component; g. said rings being bonded together in sealing relationship to hermetically seal said at least one component in an area defined by said chip, said substrate, and said rings; h. and means connecting active areas of said at least one component to respective lands of conductive material.
Claim 3
Dependent Claim
47 words
An article of manufacture as defined in claim 3 wherein said means connecting include bonding pads formed on the surface of the chip in opposed relationship to the ends of the lands on said substrate, said bonding pads being connected to the active regions of said chip.
Claim 4
Dependent Claim
37 words
An article of manufacture as defined in claim 4 further including bumps of bondable material for spanning the space between the pads on the surface of the chip and the lands on the surface of the substrate.
Claim 5
Dependent Claim
36 words
An article of manufacture as defined in claim 3 wherein said insulating ring is of a material having a coefficient of thermal expansion substantially the same as the coefficient Of thermal expansion of said semiconductor chip.
Claim 6
Dependent Claim
19 words
An article of manufacture as defined in claim 3 wherein said rings of bondable material are of a solder.
Claim 7
Dependent Claim
15 words
An article of manufacture as defined in claim 5 wherein said bumps are of solder.
Claim 8
Dependent Claim
15 words
An article of manufacture as defined in claim 5 wherein said bumps are of aluminum.
Claim 9
Dependent Claim
21 words
An article of manufacture as defined in claim 1 wherein said conductive lands terminate in said limited area in bonding pads.
Claim 10
Dependent Claim
15 words
An article of manufacture as defined in claim 3 wherein insulating ring is of glass.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1974-07-05 | 1975-01-04 | 1975-07-06 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1978-07-05 | 1979-01-04 | 1979-07-06 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1982-07-05 | 1983-01-04 | 1983-07-06 | $7700.00 | Window Closed / Lapsed |