Glue spray system

Claim 2

A glue spray system for depositing glue in globular form onto successive sheets of material conveyed along a horizontal path, said system comprising in combination, glue-filtering means in communication with a source of glue, glue-pumping means in communication with said filtering means for pumping glue having a temperature range of 60* F. to 150* F. to pressurize same for subsequent sprayed discharge onto said sheet material, globular spray discharge means in communication with said pumping and filtering means to receive and discharge the pressurized glue in globular form in a vertical spray pattern perpendicularly to the passing sheet material, said discharge means including a glue-receiving head fixedly disposed above the centerline of said passing sheet material and having glue inlet and outlet means and defining a gluereceiving chamber occupied by a transient flow of glue, a glue discharge tip in said discharge means having an oblong glue orifice transversely orientated to the path of the sheet material for shaping the glue discharged into globules to effect uniform globule deposit across said passing sheet material, and said glue filtering and pumping means including independently operable filtering and pumping components enabling glue spray system operation with one of said components each of the filtering and pumping means inoperative.

Claim 3

A glue spray system as claimed in claim 1 wherein said filtering means includes at least a pair of independent filtering units and valve means associated therewith for selectively directing a flow of glue through one of said filters and isolating thE other filter, a back-flushing system for said filters including a source of back-flushing liquid and valve means for selectively directing the liquid through said other filter for back-flushing during operation of the glue spray system.

Claim 4

A glue spray system for depositing glue in globular form onto successive sheets of material conveyed along a horizontal path, said system comprising in combination, heating means for the glue for heating same to within a temperature range of 60* F. to 150* F. preparatory to pumping with said heating means including both a steam to water heat exchanger and a water to glue heat exchanger, a steam flow control valve in communication with and regulating the supply of steam to the first mentioned heat exchanger, a first temperature responsive pilot valve responsive to the temperature of the discharged water of said first mentioned heat exchanger, a second temperature responsive pilot valve responsive to the temperature of discharged glue from the second mentioned heat exchanger, said first and second pilot valves operative in series communication with said steam flow control valve, glue-pumping means to pressurize the heated glue for subsequent sprayed discharge onto said sheet material, globular spray discharge means in communication with said pumping means to receive and discharge the heated pressurized glue in globular form in a vertical spray pattern perpendicularly to the passing sheet material, and said discharge means including a glue-receiving head fixedly disposed above the centerline of said passing sheet material and having glue inlet and outlet means and a glue-receiving chamber occupied by a transient flow of glue, a glue discharge tip in said discharge means defining an oblong glue orifice transversely orientated to the path of the sheet material, said tip shaping the glue discharged into globules to effect uniform globule deposit across said passing sheet material.

Claim 5

A glue spray system for depositing glue in globular form onto successive sheets of material conveyed along a horizontal path, said system comprising in combination, heating means for the glue for heating same to within a temperature range of 60* F. to 150* F. preparatory to pumping with said heating means including both a steam to water heat exchanger and a water to glue heat exchanger, a steam flow control valve in communication with and regulating the supply of steam to the first mentioned heat exchanger, a first temperature responsive pilot valve responsive to the temperature of the discharged water of said first mentioned heat exchanger, a second temperature responsive pilot valve responsive to the temperature of discharged glue from the second mentioned heat exchanger, said first and second pilot valves operative in series communication with said steam flow control valve, glue-pumping means to pressurize the heated glue for subsequent sprayed discharge onto said sheet material, globular spray discharge means in communication with said pumping means to receive and discharge the heated pressurized glue in globular form in a vertical spray pattern perpendicularly to the passing sheet material, and said discharge means including a glue-receiving head fixedly disposed above the centerline of said passing sheet material and having glue inlet and outlet means and a glue-receiving chamber occupied by a transient flow of glue, a glue discharge tip in said discharge means defining an oblong glue orifice transversely orientated to the path of the sheet material, said tip shaping the glue discharged into globules to effect uniform globule deposit across said passing sheet material.