Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
74 words
A uniform temperature maintaining device retaining electrical components having outwardly extending leads, which comprises a solid high thermal conductivity inner capsule, a relatively low thermal conductivity outer shell completely encapsulating said capsule, said capsule including first apertures therein receiving said components having leads and said outer shell including second apertures through which pass the leads of said components, and a high thermal conductivity, low electrical conductivity material securing said components within said first apertures.
Claim 2
Dependent Claim
74 words
A uniform temperature maintaining device retaining electrical components having outwardly extending leads, which comprises a solid high thermal conductivity inner capsule, a relatively low thermal conductivity outer shell completely encapsulating said capsule, said capsule including first apertures therein receiving said components having leads and said outer shell including second apertures through which pass the leads of said components, and a high thermal conductivity, low electrical conductivity material securing said components within said first apertures.
Claim 3
Dependent Claim
26 words
A device according to the claim 1 wherein said material is taken from the class consisting of a beryllium oxide epoxy and an aluminum oxide epoxy.
Claim 4
Dependent Claim
25 words
A device according to claim 1 wherein said components are completely encapulated in said material and said capsule is formed of an electrically conductive material.
Claim 5
Dependent Claim
25 words
A device according to claim 2 wherein said components are completely encapulated in said material and said capsule is formed of an electrically conductive material.
Claim 6
Dependent Claim
22 words
A device as set forth in claim 1 further including a mica separator positioned in said capsule and electrically isolating areas thereof.
Claim 7
Dependent Claim
22 words
A device as set forth in claim 2 further including a mica separator positioned in said capsule and electrically isolating areas thereof.
Claim 8
Dependent Claim
26 words
A device as set forth in claim 1 wherein the ratio of thermal conductivity between said outer shell and said capsule is about 1 to 1000.
Claim 9
Dependent Claim
26 words
A device as set forth in claim 2 wherein the ratio of thermal conductivity between said outer shell and said capsule is about 1 to 1000.
Claim 10
Dependent Claim
26 words
A device as set forth in claim 3 wherein the ratio of thermal conductivity between said outer shell and said capsule is about 1 to 1000.
Claim 11
Dependent Claim
32 words
A uniform temperature maintaining device which comprises a high thermal conductivity beryllium oxide epoxy inner capsule having electrical components embedded therein and a relatively low thermal conductivity outer shell encapsulating said capsule.
Claim 12
Dependent Claim
32 words
A uniform temperature maintaining device which comprises a high thermal conductivity beryllium oxide epoxy inner capsule having electrical components embedded therein and a relatively low thermal conductivity outer shell encapsulating said capsule.
Claim 13
Dependent Claim
26 words
A device as set forth in claim 10 wherein the ratio of thermal conductivity between said outer shell and said capsule is about 1 to 1000.
Claim 14
Dependent Claim
57 words
A uniform temperature maintaining device which comprises a solid high thermal conductivity inner capsule, at least one electrical component having outwardly extending leads embedded therein and a low thermal conductivity shell encapsulating said capsule and initimate therewith at all outer surfaces of said capsule, wherein said capsule is formed from a high thermal conductivity beryllium oxide epoxy.
Claim 15
Dependent Claim
57 words
A uniform temperature maintaining device which comprises a solid high thermal conductivity inner capsule, at least one electrical component having outwardly extending leads embedded therein and a low thermal conductivity shell encapsulating said capsule and initimate therewith at all outer surfaces of said capsule, wherein said capsule is formed from a high thermal conductivity beryllium oxide epoxy.