Transistor structure with heatconductive housing for cooling

Claim 1

A TRANSISTOR ASSEMBLY COMPRISING: (A) A CUP-SHAPED HEADER HAVING A BASE WALL AND A VERTICAL WALL PORTION, SAID HEADER BEING COMPOSED OF A MATERIAL OF HIGH THERMAL CONDUCTIVITY; (B) A TRANSISTOR HAVING ONE OF ITS REGIONS FIXED DIRECTLY TO SAID HEADER IN GOOD ELECTRICAL AND THERMAL CONTACT THEREWITH; (C) A CONTAINER OF HIGH THERMAL CONDUCTIVITY OPEN AT ONE END AND CLOSED AT ITS OTHER END SURROUNDING SAID TRANSISTOR AND AFFIXED TO AND BEING CLOSED BY SAID HEADER AT ITS OPEN END, WHEREBY SAID HEADER AND SAID CONTAINER TOGETHER DEFINE A COMPLETELY ENCLOSED SPACE IN WHICH SAID TRANSISTOR IS LOCATED; (D) A PLURALITY OF LEADS CONNECTED TO SAID TRANSISTOR AND EXTENDING THROUGH SAID VERTICAL WALL PORTION OF SAID HEADER AND INSULATED THEREFROM; AND (E) AN ELEMENT COMPOSED OF A MATERIAL OF HIGH THERMAL CONDUCTIVITY ATTACHED TO SAID BASE WALL OF SAID HEADER FOR FIXING SAID ASSEMBLY TO A SUPPORTING STRUCTURE OF GOOD THERMAL CHARACTERISTICS, IN HEAT EXCHANGE RELATIONSHIP THEREWITH.