Heat sink pillow

Claim 2

In combination with a heat-dissipating component, which dissipates heat from components mounted below, and a heat-sinking component which is adapted to carry off the heat in the heatdissipating component, a thermal pad comprising: a quantity of heat transfer substance of a maleable composition which would have a tendency to flow over the heat-dissipating component onto the components mounted below; and first and second strips of film being adhered at their edges to encapsulate said quantity of heat transfer substance therebetween, the encapsulated heat transfer substance disposed between and in contact with the heat-dissipating and heatsinking components to form a thermal path therethrough whereby the heat transfer substance is prevented from flowing over the heat-dissipating component onto the component mounted below.

Claim 3

The invention in accordance with claim 1 wherein said first and second strips of film are composed of a plastic material.

Claim 4

The invention in accordance with claim 1 wherein said heat transfer substance is composed of thermal grease.

Claim 5

The invention in accordance with claim 3 wherein said thermal grease is composed of a viscous substance being mixed with a filler material of high heat conductivity.

Claim 6

In combination: a plurality of electronic circuits being mounted on a module, each of said circuits having a heat-Dissipating component mounted thereon to dissipate the heat generated within said circuit, said heat-dissipating components lying substantially on the same plane; a heat-sinking component positioned contiguous to said heat-dissipating components; and a thermal pad having a pair of strips of film being adhered to each other with a quantity of heat transfer substance encapsulated therebetween, said heat transfer substance being of a maleable composition which would have a tendency to flow over the heat-dissipating component onto the electronic circuits mounted below, said thermal pad disposed between and in contact with said heat-dissipating components and said heat-sinking components for engagement therewith to form a thermal path therethrough whereby the heat transfer substance is prevented from flowing over the heat-dissipating component onto the components mounted below.

Claim 7

In combination: a plurality of electronic circuits being mounted on a module, each of said circuits having a heat-Dissipating component mounted thereon to dissipate the heat generated within said circuit, said heat-dissipating components lying substantially on the same plane; a heat-sinking component positioned contiguous to said heat-dissipating components; and a thermal pad having a pair of strips of film being adhered to each other with a quantity of heat transfer substance encapsulated therebetween, said heat transfer substance being of a maleable composition which would have a tendency to flow over the heat-dissipating component onto the electronic circuits mounted below, said thermal pad disposed between and in contact with said heat-dissipating components and said heat-sinking components for engagement therewith to form a thermal path therethrough whereby the heat transfer substance is prevented from flowing over the heat-dissipating component onto the components mounted below.

Claim 8

The invention in accordance with claim 5 wherein said first and second strips of film are composed of a plastic material.

Claim 9

The invention in accordance with claim 5 wherein said heat transfer substance is composed of thermal grease.

Claim 10

The invention in accordance with claim 7 wherein said thermal grease is composed of a viscous substance being mixed with a filler material of high heat conductivity.