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US3584183A Expired / Lapsed US ⏱️ 0.0 years remaining

Laser encoding of diode arrays

Assignee: Boeing North American Inc
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Filing: 1968-10-03
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Granted: 1971-06-08
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Expires: 1988-10-03
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Abstract

Abstract A method and means for encoding a silicon-on-sapphire diode array by bombarding selected diodes or diode connections with a pulsed laser beam to burn away chosen silicon and metallization areas. Removal of these areas from the diode matrix constitutes an encoding process by elimination of the selected connection and/or diode.

Inventors

  • 👤 Frank L Chiaretta
  • 👤 James A Luisi
  • 👤 Allen D Sypherd

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-23 14:13
CPC Classifications
G; G11; G11C; G11C17/00; G11C17/06; H; H10; H10W; H10W20/00; H10W20/40; H10W20/49; H10W20/493; H10W20/494; H10B; H10B20/00; Y; Y10; Y10S; Y10S148/00; Y10S148/071; Y10S148/15; Y10S257/00; Y10S257/926

Claims Analysis

Total Claims: 5
Claim 1
Independent Claim 20 words
The method of claim 1 wherein said pulsed laser beam is focused on said diode connections through said sapphire substrate.
Claim 2
Dependent Claim 17 words
The method of claim 1 wherein said pulsed laser beam is focused directly onto the diode connection.
Claim 3
Independent Claim 83 words
A system for encoding a diode array fabricated on a dielectric substrate, said diode array comprising a plurality of rows and columns of conductors having diodes initially connected between each of said rows and columns of conductors, said system comprising, laser means for bombarding selected diode connections with a pulsed laser beam for electrically removing said selected diode connections, means for sequentially moving said laser means from one selected diode connection to another selected diode connection until the diode array is completely encoded.
Claim 4
Independent Claim 53 words
A method for encoding a diode array fabricated on a dielectric substrate, said array having diodes initially connected between rows and columns of conductors, said method comprising the step of, positioning a laser at a selected diode location, pulsing said laser for producing a pulsed laser beam, said beam burning away the diode.
Claim 5
Independent Claim 75 words
A system for encoding a diode array fabricated on a dielectric substrate, said diode array comprising a plurality of rows and columns of conductors having diodes initially connected between each of said rows and columns of conductors, said system comprising, laser means for bombarding selected diodes for electrically removing diodes from selected connections, means for sequentially moving said laser means from one selected diode to another selected diode until the diode array is completely encoded.

References Cited (Backward Citations)

US3330696A Cited
US3314073A Cited
US3400456A Cited
US3377513A Cited
US3465091A Cited
US3472998A Cited
US3469076A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1974-06-07 1974-12-07 1975-06-08 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1978-06-07 1978-12-07 1979-06-08 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1982-06-07 1982-12-07 1983-06-08 $7700.00 Window Closed / Lapsed

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