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US3581386A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Methods of manufacturing semiconductor devices
Assignee: US Philips Corp
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Filing: 1968-07-03
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Granted: 1971-06-01
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Expires: 1988-07-03
Abstract
Abstract A METHOD FOR PROVIDING ELECTRICALLY CONDUCTIVE CONNECTIONS TO A SEMI-CONDUCTIVE DEVICE COMPRISING A BODY SEMI-CONDUCTIVE MATERIAL HAVING AN APERTURED INSULATING LAYER COVERING AT LEAST A PORTION OF THE SURFACE OF THE MATERIAL. A LAYER OF MALLEABLE METAL IS PLACED OVER AND IN CONTACT WITH THE INSULATING LAYER AND PRESSURE WELDED TO THE INSULATING LAYER AND THROUGH THE APERTURE TO THE SEMI-CONDUCTIVE MATERIAL BY APPLYING PRESSURE AND HEAT WHICH HEATS THE MATERIAL AND THE METAL LAYER TO A TEMPERATURE BELOW THE EUTECTIC TEMPERATURE OF THE SEMI-CONDUCTIVE MATERIAL AND THE METAL.
Inventors
- 👤 John Robert Dale
- 👤 Michael John Josh
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-27 23:08
CPC Classifications
H; H10; H10W; H10W20/00; H10W20/40
Claims Analysis
Total Claims: 0
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References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1974-05-31 | 1974-11-30 | 1975-06-01 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1978-05-31 | 1978-11-30 | 1979-06-01 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1982-05-31 | 1982-11-30 | 1983-06-01 | $7700.00 | Window Closed / Lapsed |