Method and apparatus for manufacturing integrated circuits

Abstract

Abstract A METHOD AND APPARATUS FOR ACCURATELY POSITIONING SOLID-STATE CHIPS, HAVING PERIPHERAL CONDUCTIVE PADS, IN RETAINING CAVITIES OF INSULATING SUBSTRATES HAVING CORRESPONDING CONDUCTIVE POINTS PREPARATORY TO BONDING THE CHIPS INTO THE SUBSTRATE AND INTERCONNECTING THE CHIP PADS AND SUBSTRATE POINTS TO FORM "INTEGRATED CIRCUITS." THE CHIP AND A PORTION OF THE AREA SURROUNDING THE CAVITY OF THE SUBSTRATE ARE OPTICALLY SCANNED IN A NUMBER OF AXES AND AN ELECTRICAL OUTPUT SIGNAL REPRESENTATIVE OF THE OPTICALLY SCANNED POINTS IS SUPPLIED TO LOGIC WHICH SELECTS THOSE ELECTRICAL PULSE WHICH REPRESENT THE SUBSTRATE CONDUCTIVE POINTS OR TERMINALS AND CHIP PAD CENTER LINES. MEASUREMENT COUNTER LOGIC IS OPERATED BY THE SELECTED PULSES TO RECORD COUNTS CORRESPONDING TO THE SELECTED SCANNED POINTS. THE RECORDED COUNTS ARE USED TO POSITION STEPPING MOTORS TO PROPERLY POSITION HE RELATIVE POSITIONS OF THE CHIP AND A CAVITY OF THE SUBSTRATE PRIOR TO PLACING THE CHIP IN THE SUBSTRATE CAVITY.

Inventors

• 👤 Hans R Rottmann

Bibliographic Details