Abstract High-voltage circuit arrangement includes a load connected to a power supply of at least 20,000 volts, and a single discrete high-voltage electrical resistor connected to the power supply and load. The high-voltage resistor comprises a spiral resistive path supported on a ceramic substrate which provides a uniform and continuous heat dissipation path between the ends of the resistor. A heat-dissipating mounting member forms an electrical termination for the resistor, rapidly transfers heat away from the substrate, and includes a substrate alignment surface and seat in close proximity to a surface of the substrate. A threaded portion of the heat-dissipating member is useful for mounting the resistor on a supporting surface and insulative means including an insulative jacket surrounds the substrate. High-voltage corona-inhibiting means include an insulative body that extends one-half inch beyond an end of the resistive path and embeds a lead wire connected to the resistive path. The resistive path is a cermet-film-type material having a resistivity of 5 megohms per square, a voltage coefficient of less than 400 parts per million per volt per square, and a voltage withstanding ability of 3,000 volts per inch of resistive path. The resistive path itself comprises an intersticed mass of inert particles and a conductive phase forming an interstitial mass within the intersticed mass. The method includes the steps of positioning the mounting member and substrate at a work station, compressively centering the substrate on the mounting member with a movable platen, controlling the transfer of heat relative to the mounting member, and soldering the mounting member to the substrate.
A method of assembling components of a resistor comprising an elongated substrate, a heat-dissipating mounting member having a seat bearing against one end of The substrate, and a substrate alignment surface, said method comprising the steps of supporting the heat-dissipating mounting member on a nest, positioning the mounting member and elongated substrate relative to each other with the substrate engaging the substrate alignment surface of the mounting member, centering said substrate on the seat of the nestedly supported heat-dissipating mounting member, securing the mounting member and substrate together, and moving the substrate and mounting member away from the nest.
Claim 2
Independent Claim
99 words
A method of assembling components of a resistor comprising an elongated substrate, a heat-dissipating mounting member having a seat bearing against one end of The substrate, and a substrate alignment surface, said method comprising the steps of supporting the heat-dissipating mounting member on a nest, positioning the mounting member and elongated substrate relative to each other with the substrate engaging the substrate alignment surface of the mounting member, centering said substrate on the seat of the nestedly supported heat-dissipating mounting member, securing the mounting member and substrate together, and moving the substrate and mounting member away from the nest.
Claim 3
Dependent Claim
39 words
The method of claim 1 wherein said step of securing the mounting member to the substrate includes the step of applying molten solder to the mounting member and a solderable pad on the substrate and solidifying the molten solder.
Claim 4
Dependent Claim
28 words
The method of claim 2 wherein the step of applying molten solder includes the step of controlling the rate of heat transfer relative to the heat-dissipating mounting member.
Claim 5
Dependent Claim
34 words
The method of claim 3 wherein the step of controlling the rate of heat transfer relative to the heat-dissipating mounting member includes the step of heating the nest that nestedly supports the mounting member.
Claim 6
Dependent Claim
37 words
The method of claim 3 wherein the step of controlling the rate of heat transfer includes the step of maintaining the temperature of the nest above the ambient temperature and below the solidus temperature of the solder.
Claim 7
Dependent Claim
34 words
The method of claim 1 wherein the step of centering the substrate includes the step of moving a centering pin carried by a movable platen into registry with a passageway formed in the substrate.