US3568761A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor mounting adapter
Assignee: RCA Corp
•
Filing: 1969-05-20
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Granted: 1971-03-09
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Expires: 1989-05-20
Abstract
Abstract A semiconductor mounting adapter comprising a base member joined to a threaded stud, and a support member joined to the base member. The support member has a mounting surface, a thick region adjacent to the base member which provides good heat dissipation characteristics, and means for mounting an encapsulated semiconductor device onto the mounting surface.
Inventors
- 👤 Robert Steven Berger
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 22:35
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/30; H10W40/00; H10W40/60; H10W40/611; H10W72/20; H10W40/20; H10W40/231; H10W40/235; H10W40/237; H10W40/242; H10W72/071; H10W72/073; H10W72/07331; H10W72/07336
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
163 words
A semiconductor device mounting arrangement comprising: a threaded stud, a base member, and a support member; said base member having an upper surface, a lower surface, and edge surfaces, with the threaded stud joined to the base member at said lower surface; said support member joined to the base member at said upper surface, the support member having: a mounting surface offset a predetermined distance from one of said edge surfaces of the base member; a thick region between said mounting surface and the opposite edge surface of the base member which provides good heat conductivity between the mounting surface and the base member; a thin region adjacent to and extending beyond the thick region, said thin region including a portion of said mounting surface; and an encapsulated semiconductor device having a device pellet mounted therein; and means for mounting said encapsulated semiconductor device onto the mounting surface of the support member, with a portion of the device pellet adjacent said thick region.
Claim 2
Dependent Claim
163 words
A semiconductor device mounting arrangement comprising: a threaded stud, a base member, and a support member; said base member having an upper surface, a lower surface, and edge surfaces, with the threaded stud joined to the base member at said lower surface; said support member joined to the base member at said upper surface, the support member having: a mounting surface offset a predetermined distance from one of said edge surfaces of the base member; a thick region between said mounting surface and the opposite edge surface of the base member which provides good heat conductivity between the mounting surface and the base member; a thin region adjacent to and extending beyond the thick region, said thin region including a portion of said mounting surface; and an encapsulated semiconductor device having a device pellet mounted therein; and means for mounting said encapsulated semiconductor device onto the mounting surface of the support member, with a portion of the device pellet adjacent said thick region.
Claim 3
Dependent Claim
26 words
A semiconductor device mounting adapter according to claim 1, in which the threaded stud, the base member, and the support member comprise an integral metal unit.
Claim 4
Dependent Claim
22 words
A semiconductor device mounting adapter according to claim 1 in which the base member is adapted to mate with a mounting tool.
Claim 5
Dependent Claim
31 words
A semiconductor device mounting adapter according to claim 1, in which the support member extends from the base member in a direction normal to the upper surface of the base member.
Claim 6
Dependent Claim
70 words
A semiconductor device mounting adapter according to claim 1, including means for mounting an encapsulated semiconductor device having a plurality of leads, said means comprising: a threaded mounting hole in said thin region of the support member, a threaded mounting hole in said thick region of the support member; and lead apertures in the thin region of the support member capable of receiving the leads of the encapsulated semiconductor device.
Claim 7
Dependent Claim
31 words
A semiconductor device mounting adapter according to claim 5, in which the thick region of the support member extends from the base member to the lead apertures of the support member.
Claim 8
Dependent Claim
140 words
A semiconductor device mounting arrangement comprising: a threaded stud, a base member, and a support member; said base member having an upper surface and a lower surface, with the threaded stud joined to the base member at said lower surface; said support member joined to the base member at said upper surface, said support member comprising: a mounting surface separated from said upper surface by a thick region which provides good heat conductivity between the mounting surface and the base member; and a thin region adjacent to and extending beyond the thick region, said thin region including a portion of said mounting surface; an encapsulated Semiconductor device having a device pellet mounted therein; and means for mounting said encapsulated semiconductor device onto the mounting surface of the support member, with a portion of the device pellet adjacent said thick region.
Claim 9
Dependent Claim
140 words
A semiconductor device mounting arrangement comprising: a threaded stud, a base member, and a support member; said base member having an upper surface and a lower surface, with the threaded stud joined to the base member at said lower surface; said support member joined to the base member at said upper surface, said support member comprising: a mounting surface separated from said upper surface by a thick region which provides good heat conductivity between the mounting surface and the base member; and a thin region adjacent to and extending beyond the thick region, said thin region including a portion of said mounting surface; an encapsulated Semiconductor device having a device pellet mounted therein; and means for mounting said encapsulated semiconductor device onto the mounting surface of the support member, with a portion of the device pellet adjacent said thick region.
Claim 10
Dependent Claim
24 words
A semiconductor device mounting adapter according to claim 7, in which the mounting surface is parallel to the upper surface of the base member.
References Cited (Backward Citations)
US3150298A
Cited
US3213336A
Cited
US3206646A
Cited
US2994203A
Cited
US3377525A
Cited
US3417300A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1974-03-08 | 1974-09-07 | 1975-03-09 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1978-03-08 | 1978-09-07 | 1979-03-09 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1982-03-08 | 1982-09-07 | 1983-03-09 | $7700.00 | Window Closed / Lapsed |