Means for housing circuit arrangements

Claim 1

A HOUSING FOR A CIRCUIT ARRANGEMENT HAVING AT LEAST ONE HEAT GENERATING ELEMENT, SAID HOUSING COMPRISING: JOINED THERMALLY AND ELECTRICALLY CONDUCTIVE WALLS FORMING A SUITABLE ENCLOSURE FOR SAID CIRCUIT ARRANGEMENT; THERMALLY AND ELECTRICALLY CONDUCTIVE SUPPORTING MEANS FOR SUPPORTING SAID HEAT GENERATING ELEMENT ON AT LEAST ONE OF SAID WALLS, SAID SUPPORTING MEANS PROVIDING A THERMALLY CONDUCTIVE PATH BETWEEN SAID HEAT GENERATING ELEMENT AND SAID ONE WALL, AND SAID SUPPORTING MEANS PROVIDING AN ELECTRICALLY CONDUCTIVE PATH FROM SAID HEAT GENERATING ELEMENT TO SAID CIRCUIT ARRANGEMENT; AN INSULATIVE FILM LOCATED BETWEEN SAID SUPPORTING MEANS AND SAID ONE WALL TO ALLOW HEAT FLOW THEREBETWEEN BUT TO IMPEDE ELECTRIC CURRENT FLOW THEREBETWEEN; A PLURALITY OF FIN MEMBERS EXTENDING OUTWARDLY FROM SAID HOUSING, SAID FIN MEMBERS COMPLETING A THERMALLY CONDUCTIVE PATH FROM SAID SUPPORTING MEANS THROUGH SAID INSULATIVE FILM AND SAID ONE WALL TO A HEAT ABSORBING MEDIUM SO THAT HEAT IS TRANSFERRED FROM SAID HEAT GENERATING ELEMENT TO SAID HEAT ABSORBING MEDIUM AT A RATE THAT PREVENS THE TEMPERATUE OF SAID HEAT GENERATING ELEMENT FROM RISING ABOVE A PREDETERMINED VALUE.