Chip capacitor

Claim 2

A low profile electrolytic capacitor suitable for mounting on a substrate, comprising: a base of an insulative material having at least two separate electrically conductive strips attached to the surface of said base aNd lying substantially parallel thereon, an at least one capacitor pellet composed of a porous anode body of a sintered film-forming metal, an oxide dielectric film formed on the surfaces of said porous body, a semiconductive oxide electrolyte layer on said dielectric film, an electrically conductive cathode coating disposed over said electrolyte, and an electrically conductive anode lead extending from the porous anode body and separated from said cathode coating, said capacitor pellet being attached to said base and said cathode coating being in electrical contact with one of said conductive strips, said anode lead being in electrical contact with another of said conductive strips, and said conductive strips having areas for making electrical connections of the capacitor to other circuit elements.

Claim 3

The capacitor of claim 1, wherein said capacitor pellet is composed of a porous anode body of one of the metals tantalum, aluminum, tungsten, columbium, hafnium, titanium, or zirconium.

Claim 4

A The capacitor of claim 1, wherein said electrolyte is one of the oxides of manganese, lead or nickel.

Claim 5

The capacitor of claim 1, wherein said electrically conductive strips on the base comprise weldable metals.

Claim 6

The capacitor of claim 1, wherein said electrically conductive strips are electrically connected to a second set of conductive strips located on the underside of the base, said second set of strips comprising metals suitable for bonding with other circuit strips.

Claim 7

The capacitor of claim 1, wherein said electrically conductive strips on the base comprise a ductile metal for ultrasonic bonding.

Claim 8

The capacitor of claim 1, wherein said electrically conductive strips on said base include at least one strip having a rectangular shape and another strip having a general L-shape, and one of the arms of the L-shaped strip is metallurgically bonded to the pellet.

Claim 9

The capacitor of claim 1, wherein said electrically conductive strips on said base include at least two strips having a rectangular shape.

Claim 10

Rectangular capacitor of claim 1, wherein said pellet has a rectangular shape.

Claim 11

The capacitor of claim 1, wherein the outer surface of said pellet comprises a coating of a metal which forms the cathode connection.

Claim 12

The capacitor as claimed in claim 10, wherein said pellet is metallurgically bonded to a portion of one of the electrically conductive strips for a cathode terminal.

Claim 13

The capacitor of claim 1, wherein a protective insulating material is spread onto and around the anode lead firmly supporting said lead on the base and preventing its electrical contact with the conductive strip thereon connected to the capacitor cathode coating.

Claim 14

The capacitor of claim 1, wherein a cathode lead electrically connects the cathode of the capacitor with one of the conductive strips on the base.

Claim 15

The capacitor of claim 1, wherein the conductive cathode coating of said pellet is covered by an outer layer of an insulative material encapsulating said pellet.

Claim 16

The capacitor of claim 1, wherein a solderable metal bar is welded to the anode lead adjacent the end thereof.

Claim 17

The capacitor of claim 15, wherein the solderable metal bar is welded to the anode lead in a crosswise position forming a T-configuration with said lead.

Claim 18

A mounted solid electrolytic capacitor comprising: at least a portion of a base of an insulative material having at least two separated electrically conductive strips attached thereto as part of a circuit structure and lying substantially parallel thereon; a solid electrolytic capacitor pellet comprising a porous anode body of a sintered film-forming metal, an oxide dielectric film formed on the surfaces of said porous body, a semiconductive oxide electrolyte layer on said dielectric film, an electrically conductive cathode coating disposed over said electrolyte, an electrically conductive anode lead extending from the porous anode body and separated from said cathode coating, and a solderable metal bar weLded to the anode lead in a crosswise position forming a T-configuration with solid lead; said capacitor pellet being attached to said base and said cathode coating being soldered to and in electrical contact with one of said conductive strips, said solderable metal bar being soldered to and in electrical contact with another of said conductive strips, and said conductive strips extending from said contacts to the capacitor for making electrical connections of the capacitor to other circuit elements.

Claim 19

A mounted solid electrolytic capacitor comprising: at least a portion of a base of an insulative material having at least two separated electrically conductive strips attached thereto as part of a circuit structure and lying substantially parallel thereon; a solid electrolytic capacitor pellet comprising a porous anode body of a sintered film-forming metal, an oxide dielectric film formed on the surfaces of said porous body, a semiconductive oxide electrolyte layer on said dielectric film, an electrically conductive cathode coating disposed over said electrolyte, an electrically conductive anode lead extending from the porous anode body and separated from said cathode coating, and a solderable metal bar weLded to the anode lead in a crosswise position forming a T-configuration with solid lead; said capacitor pellet being attached to said base and said cathode coating being soldered to and in electrical contact with one of said conductive strips, said solderable metal bar being soldered to and in electrical contact with another of said conductive strips, and said conductive strips extending from said contacts to the capacitor for making electrical connections of the capacitor to other circuit elements.