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US3560358A Expired / Lapsed US ⏱️ 0.0 years remaining

Electrolytic etching of platinum for metallization

Assignee: Motorola Solutions Inc
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Filing: 1968-09-12
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Granted: 1971-02-02
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Expires: 1988-09-12
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Abstract

Abstract A PLATINUM THIN FILM IS PATTERENED BY A SELECTIVE ETCHING PROCESS, INCLUDING THE STEP OF DEPOSITING THE PLATINUM FILM ON A CONDUCTIVE SUBSTRATE, FOLLOWED BY THE APPLICATION OF A PHOTORESIST FILM ON THE PLATINUM FILM, PATTERENED IN THE SAME IMAGE AS DESIRED IN THE PLATINUM. THE COMPOSITE STRUCTURE IS THEN SUBJECTED TO ALTERNATION CURRENT ELECTROLYSIS IN A BATH COMPRISING AN ELECTROLYTE WHICH FORMS A SOLUBLE COMPLEX WITH THE PLATINUM. THE TECHNIQUE IS SPECIFICALLY APPLIED TO THE FACRICATION OF SEMICONDUCTOR DEVICES WITH TITANIUM-PLATINUM METALLIZATION.

Inventors

  • 👤 James R Black

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-26 09:01
CPC Classifications
H; H10; H10P; H10P95/00; C; C25; C25F; C25F3/00; C25F3/02; H10W; H10W20/00; H10W20/40

Claims Analysis

Total Claims: 0
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References Cited (Backward Citations)

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USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1974-02-01 1974-08-03 1975-02-02 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1978-02-01 1978-08-03 1979-02-02 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1982-02-01 1982-08-03 1983-02-02 $7700.00 Window Closed / Lapsed

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