Combined thick and thin film circuits
Abstract
Abstract A THICK AND THIN-FILM CIRCUIT INCLUDES AT LEAST THREE GLAZED CONDUCTORS, A GLAZED DIELECTRIC FORMED OVER ONE OF THE CONDUCTORS, AND A THIN-FILM CROSSOVER RESISTOR FORMED OVER THE DIELECRIC AND CONNECTED TO THE OTHER CONDUCTORS. THE RESISTOR IS FORMED FROM A FILM WHICH IS RESISTANT TO MOST ATMOSPHERES AND SOLUTIONS WHICH WOULD ATTACK THE CONDUCTORS AND ADVERSELY AFFECT THERI ELECTRICAL AND PHYSICAL INTEGRITY. A PORTION OF THIS FILM IS LEFT OVER THE CONDUCTORS TO PROTECT THEM FROM SUCH ATMOSPHERES AND SOLUTIONS. WHERE THE FILM CAN BE BONDED TO THE SUBSTRATE WITH A BOND STRONGER THAN THAT BETWEEN THE CONDUCTORS AND THE SUBSTRATE, AS IS THE CASE OF SPUTTEREDTANTALUM NITRIDE, ANOTHER PORTION OF THE FILM IS LEFT ON THE SUBSTRATE OF EXTEND OVER THE CONDUCTORS TO FORM TABS ON OPPOSITE SIDES OF SUCH CONDUCTORS TO THEREBY MORE FIRMLY SECURE THE CONDUCTORS TO THE SUBSTRATE. D R A W I N G
Inventors
- 👤 Halle Abrams
Bibliographic Details
Claims Analysis
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