Wafer polishing apparatus and method
Abstract
Abstract A WAFER TO BE POLISHED IS MOUNTED ON ONE END OF A MOUNTING CYLINDER. AN ANNULAR FLANGE THREADED TO THE MOUNTING CYLINDER IS ADJUSTED SUCH THAT THE EXPOSED WAFER SURFACE PROTRUDES BEYOND A BRAKE SURFACE OF THE FLANGE BY A DISTANCE EQUAL TO THE THICKNESS OF THE WAFER MATERIAL TO BE REMOVED. A STABILIZING MEMBER SLIDEABLY, FITS OVER THE FLANGE TO FORM WITH THE OTHER COMPONENTS A POLISHING ASSEMBLY THAT IS THEN PLACED, WAFER SURFACE DOWN, IN A POLISHING PAN. THE PAN IS AGITATED SUCH THAT THE ASSEMBLY DESCRIBES A RANDOM MOTION UNTIL THE WAFER HAS BEEN POLISHED TO ITS DESIRED THICKNESS, AT WHICH TIME THE BRAKE SURFACE CONTACTS THE POLISHING SURFACE OF THE PAN AND TERMINATES MOVEMENT OF THE ASSEMBLY RELATIVE TO THE PAN.
Inventors
- 👤 Carl R Paola
Bibliographic Details
Claims Analysis
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| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
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| 3.5 Years (Year 4) | 1974-02-01 | 1974-08-03 | 1975-02-02 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1978-02-01 | 1978-08-03 | 1979-02-02 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1982-02-01 | 1982-08-03 | 1983-02-02 | $7700.00 | Window Closed / Lapsed |