Apparatus for minimizing stress in a heated semiconductor filament
Abstract
Abstract STRESSES ARE RELIEVED IN A HEATED SEMICONDUCTOR FILAMENT BY A SYSTEM THAT INCLUDES MEANS FOR POSITIONING THE FILAMENT HOLDERS WITH RESPECT TO EACH OTHER. A SEMICONDUCTOR FILAMENT IS SUPPORTED AT OPPOSITE ENDS BY HOLDERS WHICH ARE ADJUSTABLY MOUNTED TO THE END PLATES OF A DEPOSITION CHAMBER. THESE ADJUSTABLE MOUNTINGS MAY TAKE THE FORM OF A BELLOWS ATTACHED TO THE END PLATE AND FASTENED TO AN ELECTRODE WHICH CONNECTS A SOURCE OF ELECTRICAL ENERGY TO THE FILAMENT HOLDER. AS THE FILAMENT EXPANDS DUE TO HEATING, ONE OF THE ELECTRODES MOVES, AND THIS MOVEMENT IS SENSED BY A MOTION TRANSDUCER WHICH GENERATES A SIGNAL PROPORTIONAL TO THE ELECTRODE MOVEMENT. THE OUTPUT OF THE MOTION TRANSDUCEER DRIVES A POWER OPERATOR TO POSITION ONE OF THE TWO ELECTRODES TO ALLOW FOR THE FILAMENT EXPANSION. THUS, THE STRESSES IN THE FILAMENT DUE TO EXPANSION ARE MINIMIZED.
Inventors
- 👤 Lawrence D Dyer
Bibliographic Details
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