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US3556951A Expired / Lapsed US ⏱️ 0.0 years remaining

Method of forming leads on semiconductor devices

Assignee: GTE Sylvania Inc
•
Filing: 1967-08-04
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Granted: 1971-01-19
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Expires: 1987-08-04
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Abstract

Abstract METHOD OF FORMING SUPPORTING BEAM LEADS ON A SEMICONDUCTOR WAFER BY DEPOSITING IN SUCCESSION THIN LAYERS OF TITANIUM, MOLYBDENUM, AND GOLD, MASKING WITH NONCONDUCTIVE PHOTO-RESIST, AND ELECTROPLATING GOLD TO FORM THICK MEMBERS. THE TITANIUM, MOLYBDENUM, AND GOLD NOT COVERED BY THE GOLD MEMBERS ARE REMOVED IN A SERIES OF COMPATIBLE STEPS LEAVING BEAM LEADS OF TITANIUM, MOLYBDENUM, AND GOLD.

Inventors

  • 👤 Nino P Cerniglia
  • 👤 Richard C Tonner

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-30 23:33
CPC Classifications
H; H10; H10P; H10P95/00; C; C23; C23F; C23F1/00; C23F1/10; C23F1/14; C23F1/16; C23F1/26; H10W; H10W20/00; H10W20/40; H10W72/00; H10W72/60

Claims Analysis

Total Claims: 0
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References Cited (Backward Citations)

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USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1974-01-18 1974-07-20 1975-01-19 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1978-01-18 1978-07-20 1979-01-19 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1982-01-18 1982-07-20 1983-01-19 $7700.00 Window Closed / Lapsed

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