Patent US3537169A successfully refreshed from Google Patents.
US3537169A
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US
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Method of severing a semiconductor wafer
Assignee: US Philips Corp
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Filing: 1968-07-03
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Granted: 1970-11-03
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Expires: 1988-07-03
Abstract
No abstract record available.
Inventors
- 👤 Jacobus Eigeman
- 👤 Hermanus Antonius Van De Pas
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 09:40
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/04; H10P72/0442; H10P52/00; H10P72/0428; Y; Y10; Y10T; Y10T225/00; Y10T225/10; Y10T225/12; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49789; Y10T29/4979
Claims Analysis
Total Claims: 0
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References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1973-11-02 | 1974-05-04 | 1974-11-03 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1977-11-02 | 1978-05-04 | 1978-11-03 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1981-11-02 | 1982-05-04 | 1982-11-03 | $7700.00 | Window Closed / Lapsed |