US3529759A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Apparatus for bonding a beam-lead device to a substrate
Assignee: AT&T Inc
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Filing: 1967-06-15
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Granted: 1970-09-22
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Expires: 1987-06-15
Abstract
No abstract record available.
Inventors
- 👤 James E Clark
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 00:58
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/04; H10P72/0446; B; B23; B23K; B23K20/00; B23K20/02; B23K20/023; H10W; H10W99/00
Claims Analysis
Total Claims: 0
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References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1973-09-21 | 1974-03-23 | 1974-09-22 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1977-09-21 | 1978-03-23 | 1978-09-22 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1981-09-21 | 1982-03-23 | 1982-09-22 | $7700.00 | Window Closed / Lapsed |